MIL SPECS WUE D MM 0000125 00343507 &2b MEMILS The documentation and process conversion TNCH- POUND measures necessary to comply with this revision shall be completed by 21 March 1994 MIL-S-19500/115H 20 December 1993 SUPERSED ING MIL-S-19500/115G 2 April 1990 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE REGULATOR TYPES IN3821A THROUGH 1N3828A, 1N3016B THROUGH 1N30518, 1N3821A-1 THROUGH IN3828A-1, 1N3016B-1 THROUGH 1N3051B-1, IN3821AUR-1 THROUGH 1N3828AUR-1, IN3016BUR-1 THROUGH 1N3051BUR-1, PLUS C- AND O- TOLERANCE SUFFIX, JAN, JANTX, JANTXV, AND JANHC This specification is approved for use by all Depart- ments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for 1 Watt, silicon, voltage regulator diodes with voltage tolerances of 5 percent (2 percent and 1 percent tolerance options are available on the -1 suffix devices and JANHC). Three levels of product assurance are provided for each device type as specified in MIL-S-19500. One level of product assurance is provided for die. 1.2 Physical dimensions. See figures 1 (D0-13), 2 (similar to DO-41), 3 and 4 (JANHC). 1.3 Maximum ratings. Maximum ratings are as shown in columns 8 and 10 of table IV herein and as follows: P, = 1.0 W (DO-13 and 00-41) at T, = 95C, L = .375 (9.53 mm); both ends of case or diode body to heat sink at L = .375 (9.53 mm). (Derate I, to 0.0 mA de at T, = +175C). P, = 1.0 W (DO-213AB) at Ty, = 125C. (Derate to 0 at Tp, = 175C). 65C $T,, S$ +175C; -65C S$ Tog #175C. 1.4 Primary electrical characteristics. Primary electrical characteristic colums 2, 9, 12, and 15 of table IV herein and as fallows: 3.3 V de < V, $ 200 V de 1N38210-1 through 1N38280-1 and 1N3016D-1 through 1N3051D-1 are 1 percent voltage tolerance. 1N3821C-1 through 1N3828C-1 and 1N3016C-1 through 1N3051C-1 are 2 percent voltage tolerance. 1N3821A through 1N3828A and 1N30168 through 1N30518 are 5 percent voltage tolerance. IN3821A-1 through 1N3828A-1 and 1N3016B-1 through 1N3051B-1 are 5 percent voltage tolerance. Rox = 80C/W (maximum) at L = .375 inch (9.53 mm) (DO-13 and D0-41). Resee = 50C/W (maximum) junction to endeaps (D0-213AB). Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Electronics Supply Center, ATTN: DESC-ECT, 1507 Wilmington Pike, Dayton, OH 45444-5270, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A 1 of 18 FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.MIL SPECS OE D M@@ 0000125 0034308 ?be MMNILS aE DD Dimensions Ltr Notes Inches Millimeters Min Max Min Max $8 .026 -035 0.66 0.89 0 -215 265 5.46 6.73 4 0, .110 2.79 G 2195 .350 4.96 8.89 L 1.000 25.40 L, 221 5.33 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Dimension 0 shall be measured at the largest diameter. 4. Cathode lead shall be electrically connected to the case. If tubulation is used, it shall be on the anode end. FIGURE 1. Semiconductor device, diode, types 1N3821A through 1N3828A, and 1N3016B through 1N30518.MIL SPECS WUE D MM 0000125 0034305 79 MEMILS MIL-S-19500/115H oe L be oT LY ~ am Mh #0 Dimensions Ltr Inches Mitlimeters Min Max Min Max $B 028 034 0.71 0.86 $0 080 107, 2.03 2.72 3 G 160 205 4.06 5.21 3 L 1.110 dea 28.19 =c- Lt, 77: 050 227 1.27 4 1. Dimensions are in inches. . 2. Metric equivalents are given for general information only. 3. Package contour optional within cylinder of diameter gD and length G. Slugs, if any shall not be included within this cylinder but shall not be subject to the minimum Limit of 90. 4. Lead diameter not controlled in this zone to allow for flash, lead finish build-up, and minor irregularities other than slugs. FIGURE 2. Physical dimensions, types IN3821A-1, C-1, and D-1 through IN3828A-1, C-1, and D-1; 1N3016B-1, C-1, and 0-1 through 1N3051B8-1, C-1, and D-1 (00-41).MIL SPECS QUE D MM O0001e5 0034310 310 MEMILS MIL-S-19500/115H G0 FT SEE NOTE | = G = Dimensions Ltr Inches Millimeters Min Max Min Max G 189 205 4.80 5.21 gD 094 105 2.39 2.67 Ls, 159 REF. 4.04 REF. F 014 .022 36 56 s 901 tr .03 =-- NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Gap not controlled, shape of body and gap not controlled. FIGURE 3. Physical dimensions of surface mount family types 1N3821AUR-1, CUR-1, and DUR-1, through IN3828AUR-1, CUR-1, and DUR-1 and 1N3016BUR-1, CUR-1, and DUR-1 through IN3Z0S1BUR-1, CUR-1, and DUR-1 (DO-213A8).MIL SPEC NOTES: s WUE D EM 0000125 0034311 257 MEMILS MIL-S-19500/115H A t AQ_g ANODE B Up JH MM) BACKSIDE [S CATHODE A Version q Dimensions Ltr Inches Millimeters Min Max Min Max A -035 .039 .89 .99 B .031 -033 .79 384 Dimensions are in inches. Metric equivalents are given for general information only. The physical characteristics of the die thickness are .010 .+002 (0.25 mm). Metallization is: Top (anode) - Al, back (cathode) - Au. Al thickness = 25,000A minimum, Au thickness = 4000A minimum. FIGURE 4. Physical dimensions JANHCA die.MIL SPECS WHE D MM 0000125 00343912 193 MEMILS MIL-S-19500/115H 4 : <$<$<$. Fi WL. ANODE MQ Qvo QAQAGA 4 WIT. BACKSIDE IS CATHODE 8 Version Dimensions Ltr Inches Millimeters Min Max Min Max A .035 039 0.89 0.99 8 -027 -031 0.68 0.79 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. The physical characteristics of the die thickness are .012 .2002 (0.30 mm). Metallization is: Top (anode) - Al, back (cathode) - Au. Al thickness = 40,000 minimum, Au thickness = 5000A minimum. FIGURE 5. Physical dimensions JANHCB die.MIL SPECS HOE D MM 0000125 0034313 O2T MMILS MIL-S-19500/715H 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those Listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL*STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this specification shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Detail specification. The individual item requirements shall be in accordance with MIL-$-19500, and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions shall be as specified in MIL-S-19500. a endcap. 3.3 Design, construction, and physical dimensions. Design, construction, and physical dimensions shall be as specified in MIL-S-19500, and figures 1 (DO-13), 2 (00-41), 3 (D0-213AB), and figures 4 and 5 for (JANHC). 3.3.1 Lead finish. Lead finish shall be solderable in accordance with MIL-STD-750 and MIL-S-19500 where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). 3.3.2 Dash one construction. Dash one (-1) diodes shall be of metallurgically bonded double plug construction in accordance with MIL-$-19500. 3.4 Marking. Marking shatl be in accordance with MIL-S-19500. 3.4.1 Marking of UR version devices. For UR version devices only, all marking (except polarity) may be omitted from the body, but shall be retained on the initial container. 3.4.2 Polarity. The polarity shall be indicated with a contrasting color band to denote the cathode end or alternately with a minimum of three contrasting color dots spaced evenly around the periphery at the cathode end. 3.5 Selection of tight tolerance devices. The C and 0 suffix devices shall be selected from JAN, JANTX, or JANTXV devices, which have successfully completed all applicable screening, and groups A, B, and C testing as 5 percent tolerance devices. All sublots of C and D suffix devices shall pass group A, subgroup 2, at tighter tolerances. Tighter tolerances for mounting clip temperature shall be maintained for reference purpose to establish corretation. For C and D tolerance levels, T, = 30 2C at 0.375" from body or equivalent.MIL SPECS U4E D MM OO000Le25 0034314 TEb MEMILS MIL-S-19500/115H 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.2 Qualification inspection. Qualification inspection shall be fn accordance with MIL-S-19500, and as specified herein. 4.2.1 JANHC devices. JANHC devices shall be qualified in accordance with appendix H of MIL-S-19500. 4.2.2 Construction verification. Cross sectional photos from 3 devices shall be submitted in the qualification report. 4.3 Screening (JAN, JANTXV and JANTX levels only). Screening shall be in accordance with MIL-S-19500 (table I1), and as specified herein. The foilowing measurements shall be made in accordance with table | herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen (see table II of Measurement MIL-S-19500) JANTX and JANTXV levels JAN Level 3a Temperature cycling Temperature cycling in accordance with MIL-S-19500 JANTX level) 3c 1/ Thermal impedance (see 4.5.5) Thermal impedance (see 4.5.5) {1 9 Not applicable Not applicable 14 Ip and Vz 12 See 4.3.2,t = 48 hours 13 2/ Alp, < 100% of initial reading or 50 nA de, whichever is greater; AV? < 22% of initial reading, subgroup 2 of table I herein. 1/ Thermal impedance may be performed any time after sealing provided temperature cycling is performed in accordance with MIL-S-19500, screen 3 prior to this thermal test. 2/ PDA = 5 percent for screen 13, applies to Alpy, AVz and subgroup 2 of table ! herein. Thermal impedance (Z2gjy) is not required in screen 13. 4.3.1 Screening (JANHC). Screening of JANHC die shall be in accordance with MIL-S-19500, appendix H. As a minimum, die shall be 100-percent probed in accordance with group A, subgroup 2. 4.3.2 Power burn-in conditions. Power burn-in conditions are as follows: 1, = column 8 of table IV minimum; mounting and test conditions in accordance with MIL-STD-750, method 1038, test condition 8, TEC = +75C to #125C for surface mount devices. To better utilize burn-in equipment, higher values of I, shall be permitted provided: a. The junction temperature does not exceed +175C. b. The power dissipation does not exceed 1.2 W. 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-19500, and as specified herein.MIL SPECS UE D MM 0000825 0034315 Te MEMILS MIL-S-19500/115H 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500, and table I herein. The following test conditions shall be used for Z,,,, group A inspection: a. I, Measurement current - - - - > > 7 tt to tte 1 mA - 10 mA. b. I, forward heating current ---*- e+ ee rte 1.0A- 2.0 A. c. t, heating time +--+ ee ee rr rt tt tte 10 ms. d. tyo measurement delay time ------ +c rr 5 5 70 us maximum. 4.4.2 Group B inspection. Group 8 inspection shall be conducted in accordance with the conditions specified for subgroup testing in table IIb (JAN, JANTX and JANTXV) of MIL-S-19500, and as follows. Electrical measurements (endpoints) and delta requirements shall be jn accordance with the applicable footnotes and steps of table III herein. Subgroup Method Condition B2 4066 See 4.5.1 B3 1027 I, = I, column & of table IV; T, = +30 45C. B4 teee Not applicable B5 toee Not applicable 4.4.3 Group inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500, and as follows. Electrical measurements (endpoints) and delta requirements shall be in accordance with the applicable footnotes and steps of table Ill herein. Subgroup Method Condition c2 2036 Terminal strength: Test condition A; weight = 4 lbs; t = 15 seconds. Terminal strength: Test condition E; (Terminal strength is not required for UR-1 suffix devices). c 1026 I, = 1, column 8 of table IV; T, = +30C #5C. c7 4071 I, = 1, column 5 of table IV; T, = +25C #5C; T, = +125C & 5C; aV, = column 15 of table IV; LTPD = 10. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows: 4.5.1 Surge current (logy). The peak currents shown in column 10 of table IV shall be applied in the reverse direction and these shall be superimposed on the current (I, = 1,,) (column 5 of table IV) a total of 5 surges at 1 minute intervals. Each individual surge shall be one-half square-wave-pulse of one one-hundred twentieth second duration or an equivalent one-half sinewave with the same effective rms current. 4.5.2 Regulator voltage measurements. The test current shall be applied until thermal equilibrium is attained (90 seconds maximum) prior to reading the breakdown voltage. For this test, the surface mount device shall be mounted at the endcaps and the axial leaded device shall be suspended by its leads with mounting clips whose inside edge is located at 0.375 inch (9.53 mm) from the body and the mounting clips shall be maintained at a temperature of +25C +#8C, -2C . This measurement may be performed after a shorter time following application of the test current than that which provides thermal equilibrium if correlation to stabilized readings can be established to the satisfaction of the Government. 4.5.3 Temperature coefficient of regulator voltage (&V.). The device shall be temperature stabilized with current applied prior to reading regulator voltage at the specified ambient temperature as specified in table III, group C, subgroup 7.MIL SPECS QUE D MM 0000325 0034316 4395 MENILS MIL-S-19500/115H 4.5.4 Voltage regulation V, (reg). Voltage regulation shall be determined by the difference of the regulator voltage measured at different currents as specified in table I, group A, subgroup 7. Both tests shall be performed at thermal equilibrium. This AV, shall not exceed column 9 of table IV. 4.5.5 Thermal impedance Z5,,_measurements for screening. The Zg,, measurements shall be performed in accordance with MIL-STD-750, method 3101. The maximum Limit (not to exceed the group A, subgroup 2 limit) for Zo), in screening (table II of MIL-S-19500) shall be derived by each vendor by means of statistical process control. When the process has exhibited control and capability, the capability data shall be used to establish the fixed screening Limit. In addition to screening, once a fixed limit has been established, monitor all future sealing lots using a random five piece sample from each lot to be plotted on the applicable X, R chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the line and held for Engineering evaluation and disposition. 4.5.5.1 For initial qualification or requalification. Read and record data (2,,,) shall be supplied to the qualifying activity on one lot (random sample of 500 devices minimum). Twenty-two serialized devices shall be sent to the qualifying activity for test correlation. 4.5.6 Thermal resistance. Thermal resistance measurement shall be in accordance with MIL-STD-750, method 3101 or 4081. Forced moving air or draft shall not be permitted across the device during test. The maximum limit for Rg, under these test conditions shall be Rg, (max) = 80C/W or Rojec = 50C/W. The following conditions shalt apply when using method 3101: a Iwo r tt tt tt rt tt tt ee ee te ee ee ee 1 mA to 10 mA bo oIyo rc tt tt te te ttt te eee eee ee eee 5 Ato 1.0A Cc trot tt tt tt tt tt ee ee ee ee ee 25 seconds minimum ee 70 us maximum LS = Lead spacing = 3/8 inch as defined on figure 6 below: LS = 0 inches for "UR" suffix devices. 4.5.6.1 For initial qualifications and requalifications. Read and record data in accordance with group E herein and shall be included in the qualification report. COPPER LEAD ed \ COPPER LEAD CLAMP INFINITE HEAT-DISSIPATOR FIGURE 6. Mounting conditions. 10MIL SPECS WUE D MM 0000225 0034317 775 MMMILS MIL-S-19500/115H TABLE I. Group A_ inspection. 2/ Inspection 1/ MIL-STO-750 Symbol Limits Unit Method Conditions Min Max Subgroup 1 Visual and mechanical | 2071 examination Subgroup 2 Forward voltage 4011 I, = 200 mA de Ve 1.2 V de Reverse current 4016 DC method; V, = column 11 | Ip, Column BA dc of table IV 12 Regulator voltage 4022 IZ, = 1, = (column Vv, Column |Column V de (see 4.5.2) 5 of table IV) 3 4 Thermal impedance 3104 See 4.5.5 Zoux 15 C/W Subgroup 3 (-1 devices only) High-temperature T, = +150C operation Reverse current 4016 DC method: V, = colum 11) [Ia Column BA de of table IV 14 Subgroup 4 Small-signal reverse 4051 I, = column 5 of table IV. [2 Column ohms breakdown impedance Iz, = 10 % of I, 6 Small-signal 4051 lx == column 16 22K Column ohms knee impedance of table IV; 7 ly, = 10 % of Ix Subgroups 5, and 6 Not applicable Subgroup 7 Voltage regulation I, = 10% of column 8 AV, Column V de (see 4.5.4) of table IV (current 1) (reg) 9 I, = 50% of column 8 of table IV (current 2) 1/ For sampling plan, see MIL-S-19500 2/ Column references are to table IV herein. 11MIL SPECS WHE D MM O0001eS 0034316 01 MMNILS MIL-S-19500/115H TABLE II. Group E inspection (all product assurance levels). MIL-STD-750 Qualification Inspection 1/ conformance Method Conditions inspection (LTPD) Subgroup 1 Temperature cycling 1051 500 cycles 45/0 Electrical measurements See table III, steps 1, 2, 3, and 5, Subgroup 2 Steady-state dc 1037 6,000 cycles 45/0 intermittent life Electrical measurements See table III, steps 1, 2, and 3. Subgroup 3 Not applicable Subgroup 4 22 devices, c = 0 Thermal resistance 3101 Rojee = 50C/W (maximum) at zero surface mount or lead length. +25C < T, $ +35C, 4081 (see 4.5.6). Thermal resistance 3101 Rou, = 80C/W (maximum) at .375 22 devices, c= 0 leaded or inches lead length +25C < T, 4081 $ 35C, (see 4.5.6). i/ A separate sample may be pulled for each test. 12MIL SPECS WUE D MM 9000325 0034319 548 MBNILS MIL-S-19500/115H TABLE I1I. Group A, B, C, and E electrical end-point measurements. i/, 2/, 3/ Step Inspection MIL-STD-750 Symbol Limits 1/ Unit Method Conditions Min Max 1. Reverse current 4016 DC method, V, = column 11 la Column HA de of table IV 13 2. Breakdown voltage 4022 1, = colum 5 Vv, Column | Column V de (see 4.5.2) of table IV 3 4 3. Small-signal 4051 1, = column 5 Zz Column ohms breakdown Iy, = 10% of I, 6 impedance 4. Thermal impedance 3101 See 4.5.5 Zeux 15 C/W 1/ Column references are to table IV herein. 2/ The electrical measurements for table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500 are as follows: a. Subgroup 2, see tabie III herein, steps 1, 2, 3, and 4. b. Subgroups 3 and 6, see table III herein, steps 1, 2, and 3. 3/ The electrical measurements for table V of MIL-S-19500 are as follows: a. Subgroup 2, see table III herein, steps 1, 2, 3, and 4. b. Subgroup 3, (00-13 devices only), see table III herein, steps 1, 2, and 3. b. Subgroup 6, see table III herein, steps 1, 2, and 3. 13MIL SPECS MAXIMUM POWER DISSIPATION - MILLIWATTS FIGURE 7. HUE D GM 0000125 0034320 ebT MMILS MIL-S-19500/115H 1000 L = 0 (SURFACE MOUNT) 809 606 400 200 50 75 LOO 125 50 175 LEAD TEMPERATURE-DEGREES CELSIUS AT DESCRIBED LEAD LENGTH Maximum power versus lead temperature and lead length (see 6.4). 14MIL SPECS 5. PACKAGING 5.1 Packaging requirements. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory. ) 6.1 Notes. 6.2 Acquisition requirements. Lead finish (see 3.3.1). ao oo 6.3 Substitution information. manufacturer's and users part number. 6.3.1 JANTX1N3821A-1). 6.4 Maximum power versus lead temperature. temperature for various lead lengths is shown on figure 7. 6.5 Suppliers of JANHC die. WUE D WH 00001ec5 0034321 1Tb MMNILS MIL-S-19500/115H Issue of DODISS to be cited in the solicitation. Substitutability of 2 percent and 1 percent tolerance devices. direct one way substitute for the looser tolerance devices (example: JANHCA1N3821A) will be identified on the QPL. Packaging shall be in accordance with MIL-S-19500. The notes specified in MIL-S-19500 are applicable to this specification. Acquisition documents should specify the following: For die acquisition, the JANHC letter version should be specified (see figures 4 and 5). Product assurance level and type designation. Devices covered by this specification are substitutable for the This information in no way implies that manufacturers part numbers are suitable as a substitute for the military part number. Typical maximum power rating as a function of lead The qualified JANHC suppliers with the applicable letter version (example JANHC ordering information PIN Manufacturer CAGE 55801 12954 1IN3821A JANHCAINS821A JANHCBIN3821A through through through IN3828A | JANHCAIN3828A JANHCB1IN3828A 1N3016B | JANHCA1N3016B JANHCB1N30168 through through through 1N3051B | JANHCA1N305 1B JANHCB1N30518 NOTE: 6.6 Changes from previous issue. C and 0 tolerance suffix are applicable to JANHC. Asterisks are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. 15 Devices of tighter tolerance are a JANTX1N3821D-1 substitutes forNIL SPECS HOE D MM 0000125 0034322 032 MHNILS MIL-S-19500/115H CONCLUDING MATERIAL Custodians: Preparing activity: Army - ER Navy - EC Navy - EC Air Force - 17 Agent: NASA - NA DLA - ES Review activities: (Project 5961-1538) Army - AR, AV, MI, SM Navy - AS, CG, MC Air Force - 13, 19, 85, 99 DLA - ES 16WHE D MM 0000125 0034323 T7959 MEMILS MIL SPECS "31qQ82 JO pus 2e SaJOUJOO} 325 S2 960" + OL 2 oe | Ss OL 9 2E SB S2 Zl 0002 OLL s9 B8S 2ss 9S SBOENt Se" 960 + OL 2 Oe | S OL 8BE | 06 e Bl 00st S6} avs sss S8Y tS ALEOgNnt Se" S60" + OL @ Oe | Ss OL 8se 56 be l OOSt og| SS 69 299 dL? S9SOENL Se" 560" + OL 2 og | gS" oL 2-2 | QOL 67l be 00SL 02 09 bs? 604 y SSfOeNL Se" 960 + OL 2 o2 |] Ss OL 262 | Ol ert 2 oool 09 s9 604 L2s 6 OvEOENL Se" 60" + OL @ oz | S OL 922 | OL at 92 OooL Qs or2 ele 2 9 9 BLEOSNL Se" 160 + oL oe j S oL bs2 | OSL oL 82 oooL S? s2 9 4% 9 LE B2L0EN1L Sc" 260 + ol 2 oe] S Ot 922 O9L WL Le 0001 0+ s8 SLE S*e2 o SlLEOcNl Se" 060 + ot 2 oz] S aL 902 | Ot gb a osZ Sf a) 82 2Se Z SOZOENL Se" 880" + oL 2 o2 | S OL 2"eL 002 th 0 0s2 S2 s"OL 2S2 B22 92 G620ENL S2 280 + ot 2 o2 | s OL 291 ald ort s? osd 2 s*bb "$2 602 2 G8Z0ENL S2 980 + OL 2 o2 | $ OL 2sl Ove 560 ? 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