74ACT11245
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS031C – JULY 1987 – REVISED APRIL 1996
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
3-State Outputs Drive Bus Lines Directly
D
Inputs Are TTL-Voltage Compatible
D
Flow-Through Architecture Optimizes
PCB Layout
D
Center-Pin VCC and GND Configurations
Minimize High-Speed Switching Noise
D
EPIC
t
(Enhanced-Performance Implanted
CMOS) 1-
m
m Process
D
500-mA Typical Latch-Up Immunity at
125°C
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, and Standard Plastic 300-mil
DIPs (NT)
description
The octal bus transceiver is designed for asynchronous two-way communication between data buses. The
control-function implementation minimizes external timing requirements.
The device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on
the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the
device so that the buses are effectively isolated.
The 74ACT11245 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
OUTPUT
ENABLE
OE
DIRECTION
CONTROL
DIR OUTPUT
L L B data to A bus
L H A data to B bus
H X Isolation
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
A1
A2
A3
A4
GND
GND
GND
GND
A5
A6
A7
A8
DIR
B1
B2
B3
B4
VCC
VCC
B5
B6
B7
B8
OE
DB, DW, NT, OR PW PACKAGE
(TOP VIEW)
74ACT11245
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS031C – JULY 1987 – REVISED APRIL 1996
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol†
†This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
B8
B7
B6
B5
B4
B3
B2
B1
14
15
16
17
20
21
22
23
A8
A7
A6
A5
A4
A3
A2
A1
DIR
OE
12
11
10
9
4
3
2
1
24
13
2
1
3 EN2 [AB]
3 EN1 [BA]
G3
logic diagram (positive logic)
A8
A7
A6
A5
A4
A3
A2
A1
DIR
B8
B7
B6
B5
B4
B3
B2
B1
OE
14
15
16
17
20
21
22
23
13
12
11
10
9
4
3
2
1
24
74ACT11245
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS031C – JULY 1987 – REVISED APRIL 1996
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±200 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at TA = 55°C (in still air) (see Note 2):DB package 0.65 W. . . . . . . . . . . . . . . . . .
DW package 1.7 W. . . . . . . . . . . . . . . . . .
NT package 1.3 W. . . . . . . . . . . . . . . . . . .
PW package 0.7 W. . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150
_
C and a board trace length of 750 mils,
except for the NT package, which has a trace length of zero.
recommended operating conditions
MIN MAX UNIT
VCC Supply voltage 4.5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
VIInput voltage 0 VCC V
VOOutput voltage 0 VCC V
IOH High-level output current –24 mA
IOL Low-level output current 24 mA
D
t/
D
vInput transition rise or fall rate 0 10 ns/V
TAOperating free-air temperature –40 85 °C
74ACT11245
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS031C – JULY 1987 – REVISED APRIL 1996
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C
MIN
MAX
UNIT
PARAMETER
TEST
CONDITIONS
V
CC MIN TYP MAX
MIN
MAX
UNIT
IOH =50
m
A
4.5 V 4.4 4.4
I
OH = –
50
m
A
5.5 V 5.4 5.4
VOH
IOH =24mA
4.5 V 3.94 3.8 V
OH
I
OH = –
24
mA
5.5 V 4.94 4.8
IOH = –75 mA
{
5.5 V 3.85
IOL =50
m
A
4.5 V 0.1 0.1
I
OL =
50
m
A
5.5 V 0.1 0.1
VOL
IOL =24mA
4.5 V 0.36 0.44 V
OL
I
OL =
24
mA
5.5 V 0.36 0.44
IOL = 75 mA
{
5.5 V 1.65
IOZ A or B ports‡VO = VCC or GND 5.5 V ±0.5 ±5
m
A
IIOE or DIR VI = VCC or GND 5.5 V ±0.1 ±1
m
A
ICC VI = VCC or GND, IO = 0 5.5 V 8 80
m
A
D
ICC§One input at 3.4 V, Other inputs at GND or VCC 5.5 V 0.9 1 mA
CiVI = VCC or GND 5 V 4 pF
CoVO = VCC or GND 5 V 12 pF
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡ For I/O ports, the parameter IOZ includes the input leakage current.
§This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC.
switching characteristics over recomended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO TA = 25°C
MIN
MAX
UNIT
PARAMETER
(INPUT) (OUTPUT) MIN TYP MAX
MIN
MAX
UNIT
tPLH
AorB
BorA
1.5 6.2 9.2 1.5 10
ns
tPHL
A
or
B
B
or
A
1.5 5.4 8.6 1.5 9.1
ns
tPZH
OE
AorB
1.5 8.1 12 1.5 13.2
ns
tPZL
OE
A
or
B
1.5 8.2 11.7 1.5 12.9
ns
tPHZ
OE
AorB
1.5 9.3 11.8 1.5 12.9
ns
tPLZ
OE
A
or
B
1.5 9.8 12.9 1.5 13.9
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cd
Power dissi
p
ation ca
p
acitance
p
er transceiver
Outputs enabled
CL=50
p
F
f=1MHz
66 p
F
C
pd
Po
w
er
dissipation
capacitance
per
transcei
v
er
Outputs disabled
C
L =
50
pF
,
f
=
1
MH
z19
pF
74ACT11245
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS031C – JULY 1987 – REVISED APRIL 1996
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
2 × VCC
500 Ω
500 Ω
tPLH tPHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
W aveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
1.5 V
1.5 V
1.5 V 1.5 V
[
VCC
3 V
0 V
50% VCC 50% VCC
VOH
VOL
0 V
50% VCC 20% VCC
50% VCC 80% VCC
[
0 V
3 V
GND
Open
Input
Output
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74ACT11245DBLE OBSOLETE SSOP DB 24 TBD Call TI Call TI
74ACT11245DBR ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DW ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DWE4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DWG4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DWR ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245NSR ACTIVE SO NS 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245NSRE4 ACTIVE SO NS 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245NSRG4 ACTIVE SO NS 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245NT ACTIVE PDIP NT 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
74ACT11245NTE4 ACTIVE PDIP NT 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
74ACT11245PWLE OBSOLETE TSSOP PW 24 TBD Call TI Call TI
74ACT11245PWR ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245PWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245PWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
74ACT11245DBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1
74ACT11245DWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
74ACT11245NSR SO NS 24 2000 330.0 24.4 8.2 15.4 2.5 12.0 24.0 Q1
74ACT11245PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
74ACT11245DBR SSOP DB 24 2000 346.0 346.0 33.0
74ACT11245DWR SOIC DW 24 2000 346.0 346.0 41.0
74ACT11245NSR SO NS 24 2000 346.0 346.0 41.0
74ACT11245PWR TSSOP PW 24 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74ACT11245DBLE OBSOLETE SSOP DB 24 TBD Call TI Call TI
74ACT11245DBR ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DW ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DWE4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DWG4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DWR ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245NSR ACTIVE SO NS 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245NSRE4 ACTIVE SO NS 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245NSRG4 ACTIVE SO NS 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245NT ACTIVE PDIP NT 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
74ACT11245NTE4 ACTIVE PDIP NT 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
74ACT11245PWLE OBSOLETE TSSOP PW 24 TBD Call TI Call TI
74ACT11245PWR ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245PWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11245PWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
74ACT11245DBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1
74ACT11245DWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
74ACT11245NSR SO NS 24 2000 330.0 24.4 8.2 15.4 2.5 12.0 24.0 Q1
74ACT11245PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
74ACT11245DBR SSOP DB 24 2000 367.0 367.0 38.0
74ACT11245DWR SOIC DW 24 2000 367.0 367.0 45.0
74ACT11245NSR SO NS 24 2000 367.0 367.0 45.0
74ACT11245PWR TSSOP PW 24 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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