Memory Module Specifications KVR16E11/8KF 8GB 2Rx8 1G x 72-Bit PC3-12800 CL11 ECC 240-Pin DIMM DESCRIPTION SPECIFICATIONS This document describes ValueRAM's 1G x 72-bit (8GB) DDR3- CL(IDD) 11 cycles 1600 CL11 SDRAM (Synchronous DRAM) 2Rx8, ECC memory Row Cycle Time (tRCmin) 48.125ns (min.) module, based on eighteen 512M x 8-bit FBGA components. Refresh to Active/Refresh Command Time (tRFCmin) 260ns (min.) The SPD is programmed to JEDEC standard latency DDR31600 timing of 11-11-11 at 1.5V. This 240-pin DIMM uses gold Row Active Time (tRASmin) 35ns (min.) contact fingers. The electrical and mechanical specifications Maximum Operating Power 2.268 W* are as follows: UL Rating 94 V - 0 Operating Temperature 0o C to 85o C FEATURES Storage Temperature -55o C to +100o C * JEDEC standard 1.5V (1.425V ~1.575V) Power Supply *Power will vary depending on the SDRAM used. * VDDQ = 1.5V (1.425V ~ 1.575V) SDRAM SUPPORTED * 800MHz fCK for 1600Mb/sec/pin * 8 independent internal bank * Programmable CAS Latency: 11, 10, 9, 8, 7, 6 * Programmable Additive Latency: 0, CL - 2, or CL - 1 clock * 8-bit pre-fetch * Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] * Bi-directional Differential Data Strobe * Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm 1%) * On Die Termination using ODT pin * On-DIMM thermal sensor (Grade B) * Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C * Asynchronous Reset * PCB : Height 1.180" (30.00mm), double sided component Kingston (F-Die) Continued >> Document No. VALUERAM1382-001.A00 12/03/13 Page 1 MODULE DIMENSIONS: T E C H N O L O G Y 133.35 Units: millimeters 30.00 18.80 15.80 11.00 8.00 54.70 0.00 0.00 Document No. VALUERAM1382-001.A00 Page 2