Application Information
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4951A consists of two opera-
tional amplifiers that drive a speaker connected between their
outputs. The value of input and feedback resistors determine
the gain of each amplifier. External resistors Ri and Rf set the
closed-loop gain of AMPA, whereas two 20kΩ internal resis-
tors set AMPB's gain to -1. Figure 1 shows that AMPA's output
serves as AMPB's input. This results in both amplifiers pro-
ducing signals identical in magnitude, but 180° out of phase.
Taking advantage of this phase difference, a load is placed
between AMPA and AMPB and driven differentially (commonly
referred to as "bridge-tied load"). This results in a differential,
or BTL, gain of:
AVD = 2(Rf / Ri) (V/V) (1)
Bridge mode amplifiers are different from single-ended am-
plifiers that drive loads connected between a single amplifier's
output and ground. For a given supply voltage, bridge mode
has an advantage over the single-ended configuration: its dif-
ferential output doubles the voltage swing across the load.
Theoretically, this produces four times the output power when
compared to a single-ended amplifier under the same condi-
tions. This increase in attainable output power assumes that
the amplifier is not current limited and that the output signal
is not clipped. Under rare conditions, with unique combina-
tions of high power supply voltage and high closed loop gain
settings, the LM4951A may exhibit low frequency oscillations.
Another advantage of the differential bridge output is no net
DC voltage across the load. This is accomplished by biasing
AMP1's and AMP2's outputs at half-supply. This eliminates
the coupling capacitor that single supply, single-ended am-
plifiers require. Eliminating an output coupling capacitor in a
typical single-ended configuration forces a single-supply
amplifier's half-supply bias voltage across the load. This in-
creases internal IC power dissipation and may permanently
damage loads such as speakers.
POWER DISSIPATION
The LM4951A's dissipation when driving a BTL load is given
by Equation (2). For a 7.5V supply and a single 8Ω BTL load,
the dissipation is 1.42W.
PDMAX-MONOBTL = 4(VDD) 2 / 2π2RL (W) (2)
The maximum power dissipation point given by Equation (2)
must not exceed the power dissipation given by Equation (3):
PDMAX = (TJMAX - TA) / θJA (3)
The LM4951A's TJMAX = 150°C. In the SD package, the
LM4951A's θJA is 73°C/W when the metal tab is soldered to
a copper plane of at least 1in2. This plane can be split between
the top and bottom layers of a two-sided PCB. Connect the
two layers together under the tab with an array of vias. At any
given ambient temperature TA, use Equation (3) to find the
maximum internal power dissipation supported by the IC
packaging. Rearranging Equation (3) and substituting
PDMAX for PDMAX' results in Equation (4). This equation gives
the maximum ambient temperature that still allows maximum
stereo power dissipation without violating the LM4951A's
maximum junction temperature.
TA = TJMAX - PDMAX-MONOBTLθJA (°C) (4)
For a typical application with a 7.5V power supply and a BTL
8Ω load, the maximum ambient temperature that allows max-
imum stereo power dissipation without exceeding the maxi-
mum junction temperature is 46°C for the SD package.
TJMAX = PDMAX-MONOBTLθJA + TA (°C) (5)
Equation (5) gives the maximum junction temperature
TJMAX. If the result violates the LM4951A's maximum junction
temperature of 150°C, reduce the maximum junction temper-
ature by reducing the power supply voltage or increasing the
load resistance. Further allowance should be made for in-
creased ambient temperatures.
The above examples assume that a device is operating
around the maximum power dissipation point. Since internal
power dissipation is a function of output power, higher ambi-
ent temperatures are allowed as output power or duty cycle
decreases.
If the result of Equation (2) is greater than that of Equation (3),
then decrease the supply voltage, increase the load
impedance, or reduce the ambient temperature. Further, en-
sure that speakers rated at a nominal 8Ω do not fall below
6Ω. If these measures are insufficient, a heat sink can be
added to reduce θJA. The heat sink can be created using ad-
ditional copper area around the package, with connections to
the ground pins, supply pin and amplifier output pins. Refer
to the Typical Performance Characteristics curves for pow-
er dissipation information at lower output power levels.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is crit-
ical for low noise performance and high power supply rejec-
tion. Applications that employ a voltage regulator typically use
a 10µF in parallel with a 0.1µF filter capacitors to stabilize the
regulator's output, reduce noise on the supply line, and im-
prove the supply's transient response. However, their pres-
ence does not eliminate the need for a local 1.0µF tantalum
bypass capacitance connected between the LM4951A's sup-
ply pins and ground. Do not substitute a ceramic capacitor for
the tantalum. Doing so may cause oscillation. Keep the length
of leads and traces that connect capacitors between the
LM4951A's power supply pin and ground as short as possible.
Connecting a larger capacitor, CBYPASS, between the BY-
PASS pin and ground improves the internal bias voltage's
stability and improves the amplifier's PSRR. The PSRR im-
provements increase as the bypass pin capacitor value in-
creases. Too large, however, increases turn-on time and can
compromise the amplifier's click and pop performance. The
selection of bypass capacitor values, especially CBYPASS, de-
pends on desired PSRR requirements, click and pop perfor-
mance, system cost, and size constraints.
MICRO-POWER SHUTDOWN
The LM4951A features an active-low micro-power shutdown
mode. When active, the LM4951A's micro-power shutdown
feature turns off the amplifier's bias circuitry, reducing the
supply current. The low 0.01µA typical shutdown current is
achieved by applying a voltage to the SHUTDOWN pin that
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LM4951A