5962-9172901MVA - LINEAR TECHNOLOGY

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

Add device types 03 and 04. Editorial changes throughout.

93-11-09 M. A. FRYE

Replace reference to MIL-STD-973 with reference to MIL-PRF-38535. - ro

05-03-16 R. MONNIN

THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS REV B B B B B B B B B B

OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10

PMIC N/A PREPARED BY

SANDRA B. ROONEY

DEFENSE SUPPLY CENTER COLUMBUS

STANDARD

MICROCIRCUIT

DRAWING

CHECKED BY

CHARLES E. BESORE

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

APPROVED BY

MICHAEL A. FRYE

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DRAWING APPROVAL DATE

92-05-08

MICROCIRCUIT, LINEAR, DUAL RS-232

TRANSCEIVER, MONOLITHIC SILICON

AMSC N/A

REVISION LEVEL

B SIZE

A CAGE CODE

67268

5962-91729

SHEET

1 OF

DSCC FORM 2233

APR 97 5962-E189-05

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-91729

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 2

DSCC FORM 2234

APR 97

1. SCOPE

1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)

and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or

Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.

1.2 PIN. The PIN is as shown in the following example:

5962 - 91729 01 M V X

Federal

stock class

designator

RHA

designator

(see 1.2.1)

Device

type

(see 1.2.2)

Device

class

designator

Case

outline

(see 1.2.4)

Lead

finish

(see 1.2.5)

\ / (see 1.2.3)

Drawing number

1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are

marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A

specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

1.2.2 Device type(s). The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function

01 LT1180 Dual RS-232 transceiver with shutdown

02 LT1181 Dual RS-232 transceiver

03 LT1280 Dual RS-232 transceiver with shutdown

04 LT1281 Dual RS-232 transceiver

1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as

follows:

Device class Device requirements documentation

M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-

JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A

Q or V Certification and qualification to MIL-PRF-38535

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style

E GDIP1-T16 or CDIP2-T16 16 Dual-in-line

V GDIP1-T18 or CDIP2-T18 18 Dual-in-line

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

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B SHEET 3

DSCC FORM 2234

APR 97

1.3 Absolute maximum ratings. 1/

Supply voltage (VCC) ........................................................................ +6 V dc

Positive power supply voltage (V+) ................................................... +13.2 V dc

Negative power supply voltage (V-) .................................................. -13.2 V dc

Driver input voltage ........................................................................... V- to V+

Receiver input voltage ....................................................................... -30 V dc to +30 V dc

ON -

OFF input voltage (pin 18, device types 01, 03) ...................... GND to +12 V dc

Driver output voltage ......................................................................... V- +30 V dc to V+ -30 V dc

Receiver output voltage .................................................................... -0.3 V dc to VCC + 0.3 V dc

Short circuit duration, (V+) ................................................................ 30 seconds

Short circuit duration, (V-) ................................................................. 30 seconds

Short circuit duration, driver and receiver output ............................... Continuous

Power dissipation (PD) ...................................................................... 500 mW 2/ 3/

Thermal resistance, junction-to-case (θJC) ....................................... See MIL-STD-1835

Maximum junction temperature (TJ) .................................................. +150°C

Storage temperature range ............................................................... -65°C to +150°C

Lead temperature (soldering, 10 seconds) ........................................ +300°C

1.4 Recommended operating conditions.

Supply voltage (VCC) ........................................................................ +5.0 V dc

Ambient operating temperature range (TA) ....................................... -55°C to +125°C

2. APPLICABLE DOCUMENT S

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or

from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

____

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

2/ Must withstand the added PD due to short circuit tests; e.g. IOST and IOSR.

3/ Derate at 9.5 mW/°C above TA = +70°C.

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APR 97

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full

ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. T he certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this

drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and

herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2

herein) involving devices acquired to this drawing is required for any change that affects this drawing.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the

option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made

available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 53 (see MIL-PRF-38535, appendix A).

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DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics.

Test

Symbol

Conditions 1/

-55°C ≤ TA ≤ +125°C

VCC = 5.0 V,

Group A

subgroups

Device

type

Limits 2/ Unit

VON-OFF = 3.0 V dc,

unless otherwise specified

Min Max

Output voltage swing VOUT Positive, TR1, TR2 each loaded

with 3 kΩ to GND 1,2,3 All 5.0 V

Negative, TR1, TR2 each loaded

with 3 kΩ to GND -5.0

Low level input voltage

VIL V

OUT = high 1,2,3 All 0.8 V

High level input voltage

VIH V

OUT = low 1,2,3 All 2.0 V

Logic input current high

IIH V

IN ≥ 2.0 V 1,2,3 All 20

µA

Logic input current low

IIL V

IN ≤ 0.8 V 1,2,3 All 20

µA

Output short circuit

current (transmitter) IOST Sourcing current,

VOUT = 0 V, TA = +25°C

1 All 7 mA

Sinking current,

VOUT = 0 V, TA = +25°C

-7

Output leakage current

(transmitter) IOZT V

OUT = ±30 V dc, 3/

shutdown mode

1,2,3 01 100

µA

1,3 03 25

2 100

Slew rate SR RL = 3 kΩ, CL = 51 pF,

TA = +25°C

4 All 4 30

V/µs

RS-232 input threshold

low VTL V

OUT = high 1,2,3 All 0.2 V

RS-232 input threshold

high VTH V

OUT = low 1,2,3 All 3.0 V

RS-232 input hysteresis

VH 1,2,3 All 0.1 1.0 V

Receiver input

resistance RI T

A = +25°C 1 All 3 7

kΩ

Receiver output high

voltage VOH I

OUT = 160 µA, VCC = 5 V 1,2,3 All 3.5 V

Receiver output low

voltage VOL I

OUT = -1.6 mA 1,2,3 All 0.4 V

See footnotes at end of table.

STANDARD

MICROCIRCUIT DRAWING

SIZE

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COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 6

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics – Continued.

Test

Symbol

Conditions 1/

-55°C ≤ TA ≤ +125°C

VCC = 5.0 V,

Group A

subgroups

Device

type

Limits 2/ Unit

VON-OFF = 3.0 V dc,

unless otherwise specified

Min Max

Output short circuit

current (receiver) IOSR V

OUT = VCC, sinking current,

TA = +25°C

1 All -10 mA

VOUT = 0 V dc, TA = +25°C, 1 01,02 0.6

sourcing current 03,04 0.3

Output leakage

current (receiver) IOZR 0 V ≤ VOUT = VCC, 3/

sinking current

1,2,3 01,03 10

µA

Supply current ICC Outputs unloaded 4/ 1,3 01,02 23 mA

2 30

1,2,3 03,04 14

Supply leakage current ICZZ Shutdown mode 3/ 4/ 1,2,3 01 100

µA

1,3 03 25

2 100

ON-OFF pin current ISHUT 0 V ≤ VON-OFF ≤ 5 V 3/ 4/ 1,2,3 01,03 -15 80

µA

1/ External capacitors; for device types 01 and 02 = 0.1 µF, for device types 03 and 04 = 1.0 µF.

2/ The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum,

is used in this table.

3/ For device type 01: VON-OFF = 0.4 V for -55°C ≤ TA ≤ +50°C, and VON-OFF = 0.2 V for +50°C ≤ TA ≤ +125°C.

For device type 03: VON-OFF = 0.4 V for -55°C ≤ TA ≤ +100°C, and VON-OFF = 0.2 V for +100°C ≤ TA ≤ +125°C.

4/ VCC = 5 V, external loading of V+ and V- equals zero, and the driver outputs are low (inputs high).

STANDARD

MICROCIRCUIT DRAWING

SIZE

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COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 7

DSCC FORM 2234

APR 97

Device type 01, 03 02, 04

Case outlines V E

Terminal

number Terminal symbol

1 NC C1+

2 C1+ V+

3 V+ C1-

4 C1- C2+

5 C2+ C2-

6 C2- V-

7 V- TR2 OUT

8 TR2 OUT REC 2 IN

9 REC 2 IN REC 2 OUT

10 REC 2 OUT TR2 IN

11 TR2 IN TR1 IN

12 TR1 IN REC 1 OUT

13 REC 1 OUT REC 1 IN

14 REC 1 IN TR1 OUT

15 TR1 OUT GND

16 GND

VCC

17 VCC ---

18 VON-OFF ---

FIGURE 1. Terminal connections.

STANDARD

MICROCIRCUIT DRAWING

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DSCC FORM 2234

APR 97

4. VERIFICAT ION

4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with

MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan

shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in

accordance with MIL-PRF-38535, appendix A.

4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted

on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in

accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.

4.2.1 Additional criteria for device class M.

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition A, B, C, or D. T he test circuit shall be maintained by the manufacturer under document revision

level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1015.

(2) TA = +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table II herein.

4.2.2 Additional criteria for device classes Q and V.

a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the

device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under

document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table II herein.

c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in

MIL-PRF-38535, appendix B.

4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in

accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups

A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).

4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with

MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for

device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed

for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections

(see 4.4.1 through 4.4.4).

4.4.1 Group A inspection.

a. Tests shall be as specified in table II herein.

b. Subgroups 5, 6, 7, 8, 9, 10 and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.

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TABLE II. Electrical test requirements.

Test requirements Subgroups

(in accordance with

MIL-STD-883,

method 5005, table I)

Subgroups

(in accordance with

MIL-PRF-38535, table III)

Device

class M Device

class Q Device

class V

Interim electrical

parameters (see 4.2) 1 1 1

Final electrical

parameters (see 4.2) 1,2,3,4 1/ 1,2,3,4 1/ 1,2,3,4 1/

Group A test

requirements (see 4.4) 1,2,3,4 1,2,3,4 1,2,3,4

Group C end-point electrical

parameters (see 4.4) 1 1 1,2,3,4

Group D end-point electrical

parameters (see 4.4) 1 1 1

Group E end-point electrical

parameters (see 4.4) --- --- ---

1/ PDA applies to subgroup 1.

4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.

4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:

a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the

inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of

MIL-STD-883.

b. TA = +125°C, minimum.

c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,

or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The

test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the

inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-

883.

4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.

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DSCC FORM 2234

APR 97

4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured

(see 3.5 herein).

a. End-point electrical parameters shall be as specified in table II herein.

b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as

specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to

radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device

classes must meet the postirradiation end-point electrical parameter limits as defined in table I at

A = +25°C ±5°C, after exposure, to the subgroups specified in table II herein.

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes

Q and V or MIL-PRF-38535, appendix A for device class M.

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications

(original equipment), design applications, and logistics purposes.

6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor

prepared specification or drawing.

6.1.2 Substitutability. Device class Q devices will replace device class M devices.

6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system

application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users

and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic

devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.

6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614)

692-0547.

6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in

MIL-PRF-38535 and MIL-HDBK-1331.

6.6 Sources of supply.

6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.

The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to

this drawing.

6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.

The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been

submitted to and accepted by DSCC-VA.

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 05-03-16

Approved sources of supply for SMD 5962-91729 are listed below for immediate acquisition information only and shall

be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised

to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate

of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next

dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of

supply at http://www.dscc.dla.mil/Programs/Smcr/.

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

5962-9172901MVA 3/ LT1180MJ/883

5962-9172902MEA 60264 MTL1181MD16

3/ LT1181MJ/883

5962-9172903MVA 3/ LT1280MJ/883

5962-9172904MEA 3/ LT1281MJ/883

1/ The lead finish shown for each PIN representing

a hermetic package is the most readily available

from the manufacturer listed for that part. If the

desired lead finish is not listed contact the vendor

to determine its availability.

2/ Caution. Do not use this number for item

acquisition. Items acquired to this number may not

satisfy the performance requirements of this drawing.

3/ Not available from an approved source of supply.

Vendor CAGE Vendor name

number and address

60264 Minco Technology Labs, Inc.

1805 Rutherford Lane

Austin, TX 78754-5101

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoever for any inaccuracies in the

information bulletin.