PZTA14T3 - Motorola / Freescale Semiconductor

Motorola Small–Signal Transistors, FETs and Diodes Device Data

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This NPN small signal darlington transistor is designed for use in switching

applications, such as print hammer, relay, solenoid and lamp drivers. The

device is housed in the SOT -223 package, which is designed for medium power

surface mount applications.

•High fT: 125 MHz Minimum

•The SOT-223 Package can be soldered using wave or reflow.

•SOT-223 package ensures level mounting, resulting in improved thermal

conduction, and allows visual inspection of soldered joints. The formed

leads absorb thermal stress during soldering, eliminating the possibility of

damage to the die.

•Available in 12 mm Tape and Reel

Use PZTA14T1 to order the 7 inch/1000 unit reel

Use PZTA14T3 to order the 13 inch/4000 unit reel

•The PNP Complement is PZTA64T1

MAXIMUM RATINGS (TC = 25°C unless otherwise noted)

Rating Symbol Value Unit

Collector-Emitter Voltage VCES 30 Vdc

Collector-Emitter Voltage VCEO 30 Vdc

Emitter-Base Voltage VEBO 10 Vdc

Collector Current IC300 mAdc

Total Power Dissipation @ TA = 25°C(1) PD1.5 Watts

Operating and Storage Temperature Range TJ, Tstg –65 to 150 °C

DEVICE MARKING

P1N

THERMAL CHARACTERISTICS

Thermal Resistance

Junction-to-Ambient (surface mounted) RθJA 83.3 °C/W

Maximum Temperature for Soldering Purposes

Time in Solder Bath TL260

10 °C

Sec

1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.

Thermal Clad is a trademark of the Bergquist Company

Preferred devices are Motorola recommended choices for future use and best overall value.

Order this document

by PZTA14T1/D



SEMICONDUCTOR TECHNICAL DATA

 Motorola, Inc. 1996



SOT–223 PACKAGE

MEDIUM POWER

NPN SILICON

DARLINGTON

TRANSISTOR

SURFACE MOUNT

Motorola Preferred Device

CASE 318E-04, STYLE 1

TO-261AA

123

COLLECTOR 2, 4

BASE

EMITTER 3

REV 1

PZTA14T1

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristics Symbol Min Typ Max Unit

OFF CHARACTERISTICS

Collector-Base Breakdown Voltage

(IC = 100 µAdc, IE = 0) V(BR)CBO 30 — — Vdc

Collector-Emitter Breakdown Voltage

(IC = 100 µAdc, IB = 0) V(BR)CES 30 — — Vdc

Emitter-Base Breakdown Voltage

(IE = 10 µAdc, IC = 0) V(BR)EBO 10 — — Vdc

Collector-Base Cutoff Current

(VCB = 30 Vdc, IE = 0) ICBO — — 0.1 µAdc

Emitter-Base Cutoff Current

(VEB = 10 Vdc, IC = 0) IEBO — — 0.1 µAdc

ON CHARACTERISTICS (2)

DC Current Gain

(IC = 10 mAdc, VCE = 5.0 Vdc)

(IC = 100 mAdc, VCE = 5.0 Vdc)

hFE 10,000

20,000 —

——

—

Collector-Emitter Saturation Voltage

(IC = 100 mAdc, IB = 0.1 mAdc) VCE(sat) — — 1.5 Vdc

Base-Emitter On Voltage

(IC = 100 mAdc, VCE = 5.0 Vdc) VBE(on) — — 2.0 Vdc

DYNAMIC CHARACTERISTICS

Current-Gain — Bandwidth Product

(IC = 10 mAdc, VCE = 5.0 Vdc) fT125 — — MHz

2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.

PZTA14T1

Motorola Small–Signal Transistors, FETs and Diodes Device Data

TYPICAL ELECTRICAL CHARACTERISTICS

200 k

500

IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain

TJ = 125

VCE = 5.0 V

100 k

70 k

50 k 25

30 k

20 k

10 k

7.0 k

5.0 k

3.0 k

2.0 k 30020010070503020107.05.0

–55

hFE, DC CURRENT GAIN

4.0

500

IC, COLLECTOR CURRENT (mA)

Figure 2. High Frequency Current Gain

|hFE|, SMALL-SIGNAL CURRENT GAIN

2.0

1.0

0.8

0.6

0.4

0.2 20010010 20 500.5 1.0 2.0 0.5

VCE = 5.0 V

f = 100 MHz

TJ = 25

1.6

500

IC, COLLECTOR CURRENT (mA)

V, VOLTAGE (VOLTS)

Figure 3. “On” Voltages

TJ = 25

VBE(sat) @ IC/IB = 1000

VBE(on) @ VCE = 5.0 V

VCE(sat) @ IC/IB = 1000

1.4

1.2

1.0

0.8

0.6 30020010070503020107.05.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

TJ = 25

7.0

5.0

3.0

2.0 20101.0 2.0 4.00.04 0.1 0.2 0.4

Cibo

Cobo

TJ = 25

3.0

1000

IB, BASE CURRENT (

Figure 5. Collector Saturation Region

2.5

2.0

1.5

1.0

0.5 100 200 50010 20 500.1 0.2 0.5 1.0 2.0 5.0

VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)

IC = 10 mA 50 mA 250 mA 500 mA

IC, COLLECTOR CURRENT (mA)

Figure 6. Temperature Coefficients

RV, TEMPERATURE COEFFICIENT (mV/ C)

–1.0

5.0

VB for VBE

–2.0

–3.0

–4.0

–5.0

–6.0 7.0 10 20 30 50 70 100 200 300 500

*APPLIES FOR IC/IB

≤

hFE/3.0 25

C to 125

–55

C to 25

C to 125

–55

C to 25

C, CAPACITANCE (pF)

VC for VCE(sat)

PZTA14T1

4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

0.079

2.0

0.15

3.8

0.248

6.3

0.079

2.0

0.059

1.5 0.059

1.5

0.091

2.3

inches

0.091

2.3

SOT-223

SOT-223 POWER DISSIPATION

The power dissipation of the SOT-223 is a function of the

pad size. This can vary from the minimum pad size for

soldering to a pad size given for maximum power dissipation.

Power dissipation for a surface mount device is determined

by TJ(max), the maximum rated junction temperature of the

die, RθJA, the thermal resistance from the device junction to

ambient, and the operating temperature, TA. Using the

values provided on the data sheet for the SOT-223 package,

PD can be calculated as follows:

PD = TJ(max) – TA

RθJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature T A of 25°C, one can

calculate the power dissipation of the device which in this

case is 1.5 watts.

PD = 150°C – 25°C

83.3°C/W

= 1.5 watts

The 83.3°C/W for the SOT-223 package assumes the use

of the recommended footprint on a glass epoxy printed circuit

board to achieve a power dissipation of 1.5 watts. There are

other alternatives to achieving higher power dissipation from

the SOT-223 package. One is to increase the area of the

collector pad. By increasing the area of the collector pad, the

power dissipation can be increased. Although the power

dissipation can almost be doubled with this method, area is

taken up on the printed circuit board which can defeat the

purpose of using surface mount technology. A graph of RθJA

versus collector pad area is shown in Figure 7.

0.8 Watts

1.25 Watts* 1.5 Watts

R , Thermal Resistance, Junction

to Ambient ( C/W)

A, Area (square inches)

0.0 0.2 0.4 0.6 0.8 1.0

160

140

120

100

Figure 7. Thermal Resistance versus Collector

Pad Area for the SOT-223 Package (Typical)

Board Material = 0.0625

″

G-10/FR-4, 2 oz Copper TA = 25

*Mounted on the DPAK footprint

Another alternative would be to use a ceramic substrate or

an aluminum core board such as Thermal Clad. Using a

board material such as Thermal Clad, an aluminum core

board, the power dissipation can be doubled using the same

footprint.

PZTA14T1

Motorola Small–Signal Transistors, FETs and Diodes Device Data

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

circuit board, solder paste must be applied to the pads. A

solder stencil is required to screen the optimum amount of

solder paste onto the footprint. The stencil is made of brass

or stainless steel with a typical thickness of 0.008 inches.

The stencil opening size for the SOT-223 package should be

the same as the pad size on the printed circuit board, i.e., a

1:1 registration.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•Always preheat the device.

•The delta temperature between the preheat and soldering

should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference should be a maximum of 10°C.

•The soldering temperature and time should not exceed

260°C for more than 10 seconds.

•When shifting from preheating to soldering, the maximum

temperature gradient should be 5°C or less.

•After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied during

cooling

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control

settings that will give the desired heat pattern. The operator

must set temperatures for several heating zones, and a

figure for belt speed. Taken together, these control settings

make up a heating “profile” for that particular circuit board.

On machines controlled by a computer, the computer

remembers these profiles from one operating session to the

next. Figure 7 shows a typical heating profile for use when

soldering a surface mount device to a printed circuit board.

This profile will vary among soldering systems but it is a good

starting point. Factors that can affect the profile include the

type of soldering system in use, density and types of

components on the board, type of solder used, and the type

of board or substrate material being used. This profile shows

temperature versus time. The line on the graph shows the

actual temperature that might be experienced on the surface

of a test board at or near a central solder joint. The two

profiles are based on a high density and a low density board.

The Vitronics SMD310 convection/infrared reflow soldering

system was used to generate this profile. The type of solder

used was 62/36/2 Tin Lead Silver with a melting point

between 177–189°C. When this type of furnace is used for

solder reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because it has a large surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

STEP 1

PREHEAT

ZONE 1

“RAMP”

STEP 2

VENT

“SOAK”

STEP 3

HEATING

ZONES 2 & 5

“RAMP”

STEP 4

HEATING

ZONES 3 & 6

“SOAK”

STEP 5

HEATING

ZONES 4 & 7

“SPIKE”

STEP 6

VENT STEP 7

COOLING

200

150

100

TIME (3 TO 7 MINUTES TOTAL) TMAX

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

205

219

PEAK AT

SOLDER

JOINT

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

100

150

C160

170

140

Figure 8. Typical Solder Heating Profile

PZTA14T1

6 Motorola Small–Signal Transistors, FETs and Diodes Device Data

PACKAGE DIMENSIONS

TO-261AA

SOT–223

STYLE 1:

PIN 1. BASE

2. COLLECTOR

3. EMITTER

4. COLLECTOR

1 2 3

0.08 (0003)

DIM

AMIN MAX MIN MAX

MILLIMETERS

0.249 0.263 6.30 6.70

INCHES

B0.130 0.145 3.30 3.70

C0.060 0.068 1.50 1.75

D0.024 0.035 0.60 0.89

F0.115 0.126 2.90 3.20

G0.087 0.094 2.20 2.40

H0.0008 0.0040 0.020 0.100

J0.009 0.014 0.24 0.35

K0.060 0.078 1.50 2.00

L0.033 0.041 0.85 1.05

M0 10 0 10

S0.264 0.287 6.70 7.30

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

_ _ _ _

CASE 318E–04

ISSUE H

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola

data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”

must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of

others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury

or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal

Opportunity/Affirmative Action Employer.

How to reach us:

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PZTA14T1/D

*PZTA14T1/D*

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