www.ti.com
FEATURES
1
2
3
4
8
7
6
5
EMIT OUT
IN+
IN−
VCC−
VCC+
COL OUT
BAL/STRB
BALANCE
D PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
LM211-EPDIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
Controlled Baseline Maximum Input Bias Current . . . 300 nA One Assembly/Test Site, One Fabrication Maximum Input Offset Current . . . 70 nASite
Can Operate From Single 5-V SupplyExtended Temperature Performance of–55 °C to 125 °CEnhanced Diminishing ManufacturingSources (DMS) SupportEnhanced Product Change NotificationQualification Pedigree
(1)
Fast Response TimesStrobe Capability(1) Component qualification in accordance with JEDEC andindustry standards to ensure reliable operation over anextended temperature range. This includes, but is not limitedto, Highly Accelerated Stress Test (HAST) or biased 85/85,temperature cycle, autoclave or unbiased HAST,electromigration, bond intermetallic life, and mold-compoundlife. Such qualification testing should not be viewed asjustifying use of this component beyond specifiedperformance and environmental limits.
The LM211-EP is a single high-speed voltage comparator. This device is designed to operate from a wide rangeof power-supply voltages, including ±15-V supplies for operational amplifiers and 5-V supplies for logic systems.The output levels are compatible with most TTL and MOS circuits. This comparator is capable of driving lampsor relays and switching voltages up to 50 V at 50 mA. All inputs and outputs can be isolated from systemground. The outputs can drive loads referenced to ground, V
CC+
or V
CC–
. Offset balancing and strobe capabilitiesare available, and the outputs can be wired-OR connected. If the strobe is low, the output is in the off state,regardless of the differential input.
ORDERING INFORMATION
V
IO
maxT
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKINGAT 25 °C
–40 °C to 125 °C 3 mV SOIC D Tape and reel LM211QDREP LM211E–55 °C to 125 °C 3 mV SOIC D Tape and reel LM211MDREP LM211M
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002–2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
BAL/STRB
COL OUT
IN−
IN+
BALANCE
EMIT OUT
+
All resistor values shown are nominal.
BAL/STRB BALANCE
IN+
IN−
450 450
2.4
k
1.2 k
70
2.4
k
1.2 k
60
400
450
2 k
200 250
600
130
4
4 k
VCC+
VCC
EMIT OUT
COL OUT
750 600
Component Count
Resistors 20
Diodes 2
EPI FET 1
Transistors 22
LM211-EP
DIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
FUNCTIONAL BLOCK DIAGRAM
SCHEMATIC
2
Submit Documentation Feedback
www.ti.com
Absolute Maximum Ratings
(1)
Recommended Operating Conditions
LM211-EPDIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC+
18V
CC–
Supply voltage
(2)
–18 VV
CC+
V
CC–
36V
ID
Differential input voltage
(3)
±30 VV
I
Input voltage, either input
(2) (4)
±15 VVoltage from emitter output to V
CC–
30 VVoltage from collector output to V
CC–
50 VDuration of output short circuit
(5)
10 sT
J
Junction temperature 148 °Cθ
JA
Package thermal impedance
(6)
97 °C/WLead temperature 1,6 mm (1/16 in) from case for 10 s 260 °CT
stg
Storage temperature range
(7)
–65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values, unless otherwise noted, are with respect to the midpoint between V
CC+
and V
CC–
.(3) Differential voltages are at IN+ with respect to IN–.(4) The magnitude of the input voltage must never exceed the magnitude of the supply voltage or ±15 V, whichever is less.(5) The output may be shorted to ground or either power supply.(6) The package thermal impedance is calculated in accordance with JESD 51-7.(7) Long-term high–temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction ofoverall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
MIN MAX UNIT
V
CC+
V
CC–
Supply voltage 3.5 30 VV
I
Input voltage (|V
CC+
|15 V) V
CC–
+ 0.5 V
CC+
1.5 VT
A
Operating free-air temperature range for Q temp –40 125 °CT
A
Operating free-air temperature range for M temp –55 125 °C
3Submit Documentation Feedback
www.ti.com
Electrical Characteristics
Switching Characteristics
LM211-EP
DIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
at specified free-air temperatures of Q and M temp ranges, V
CC+
=±15 V (unless otherwise noted)
PARAMETER TEST CONDITIONS T
A
(1)
MIN TYP
(2)
MAX UNIT
25 °C 0.7 3V
IO
Input offset voltage
(3)
mVFull range 425 °C 4 10I
IO
Input offset current
(3)
nAFull range 2025 °C 75 100I
IB
Input bias current V
O
= 1 V to 14 V nAFull range 150I
IL(S)
Low-level strobe current
(4)
V
(strobe)
= 0.3 V, V
ID
10 mV 25 °C –3 mACommon-mode input 13 to 13.8 toV
ICR
Full range Vvoltage range –14.5 –14.7Large-signal differentialA
VD
V
O
= 5 V to 35 V, R
L
= 1 k 25 °C 40 200 V/mVvoltage amplification
I
(strobe)
= –3 mA, V
OH
= 35 V, 25 °C 0.2 10 nAHigh-level (collector)I
OH
V
ID
= 5 mVoutput leakage current
Full range 0.5 µAI
OL
= 50 mA, V
ID
= –5 mV 25 °C 0.75 1.5Low-level (collector-to-emitter)
V
OL
VV
CC+
= 4.5 V, V
CC–
= 0,output voltage
Full range 0.23 0.4I
OL
= 8 mA, V
ID
= –6 mVI
CC+
Supply current from V
CC+
, output low V
ID
= –10 mV, No load 25 °C 5.1 6 mAI
CC–
Supply current from V
CC–
, output high V
ID
= 10 mV, No load 25 °C –4.1 –5 mA
(1) Unless otherwise noted, all characteristics are measured with BALANCE and BAL/STRB open and EMIT OUT grounded.Full range is –40 °C to 125 °C for Q temp and -55 °C to 125 °C for M temp.(2) All typical values are at T
A
= 25 °C.(3) The offset voltages and offset currents given are the maximum values required to drive the collector output up to 14 V or down to 1 Vwith a pullup resistor of 7.5 k to V
CC+
. These parameters actually define an error band and take into account the worst-case effects ofvoltage gain and input impedance.(4) The strobe should not be shorted to ground; it should be current driven at –3 mA to –5 mA (see Figure 13 and Figure 27 ).
V
CC+
=±15 V, T
A
= 25 °C
PARAMETER TEST CONDITIONS TYP UNIT
Response time, low-to-high-level output R
C
= 500 to 5 V, C
L
= 5 pF
(1)
115 nsResponse time, high-to-low-level output R
C
= 500 to 5 V, C
L
= 5 pF
(1)
165 ns
(1) The response time specified is for a 100-mV input step with 5-mV overdrive and is the interval between the input step function and theinstant when the output crosses 1.4 V.
4
Submit Documentation Feedback
www.ti.com
TYPICAL CHARACTERISTICS
NOTE A: Condition 1 is with BALANCE and BAL/STRB open.
Condition 2 is with BALANCE and BAL/STRB connected to
VCC+.
250
200
100
50
0
450
150
−60 −40 −20 0 20 40 60
− Input Bias Current − nA
350
300
400
500
80 100 120 140
IIB
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE
TA − Free-Air Temperature − °C
LM211
Condition 2
VCC± = ±15 V
VO = 1 V to 14 V
See Note A
LM211
Condition 1
NOTE A: Condition 1 is with BALANCE and BAL/STRB open.
Condition 2 is with BALANCE and BAL/STRB connected to
VCC+.
10
8
4
2
0
18
6
−60 −40 −20 0 20 40 60
− Input Offset Current − nA
14
12
16
INPUT OFFSET CURRENT
vs
FREE-AIR TEMPERATURE
20
80 100 120 140
TA − Free-Air Temperature − °C
IIO
Condition 2
Condition 1
LM211
LM211
VCC± = ±15 V
VO = 1 V to 14 V
See Note A
LM211-EPDIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the variousdevices.
Figure 1. Figure 2.
5Submit Documentation Feedback
www.ti.com
30
20
10
0−1 −0.5 0
− Output Voltage − V
40
50
VOLTAGE TRANSFER CHARACTERISTICS
60
0.5 1
VO
VID − Differential Input Voltage − mV
VID
VCC+ = 30 V
1 k
Output
VCC
VI = 50 V
VID
VCC+ = 30 V
600
VCC
Output
COLLECTOR OUTPUT TRANSFER CHARACTERISTIC
TEST CIRCUIT FOR FIGURE 3
EMITTER OUTPUT TRANSFER CHARACTERISTIC
TEST CIRCUIT FOR FIGURE 3
Collector
Output
RL = 1 k
LM211
Emitter Output
RL = 600
VCC+ = 30 V
VCC = 0
TA = 25°C
LM211-EP
DIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
TYPICAL CHARACTERISTICS (continued)Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the variousdevices.
Figure 3.
6
Submit Documentation Feedback
www.ti.com
4
3
1
00 50 100 150 200 250
5
t − Time − ns 300 350
2
Differential
Input Voltage
− Output Voltage − VVO
OUTPUT RESPONSE FOR
VARIOUS INPUT OVERDRIVES
100 mV
20 mV
2 mV
5 mV
VCC± = ±15 V
RC = 500 to 5 V
TA = 25°C
4
3
1
00 50 100 150 200 250
5
t − Time − ns
OUTPUT RESPONSE FOR
VARIOUS INPUT OVERDRIVES
300 350
2
Differential
Input Voltage
− Output Voltage − VVO
20 mV
5 mV 2 mV
100 mV
VCC± = ±15 V
RC = 500 to 5 V
TA = 25°C
LM211-EPDIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
TYPICAL CHARACTERISTICS (continued)Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the variousdevices.
Figure 4. Figure 5.
7Submit Documentation Feedback
www.ti.com
5
0
−10
−15 0 0.2 0.4 0.6 0.8 1.0
10
t − Time − s
1.2 1.4
−5
Differential
Input Voltage
− Output Voltage − VVO
OUTPUT RESPONSE FOR
VARIOUS INPUT OVERDRIVES
15
1.6 1.8
20 mV
100 mV
2 mV
5 mV
VCC± = ±15 V
RE = 2 k to −15 V
TA = 25°C
m
t − Time − s
OUTPUT RESPONSE FOR
VARIOUS INPUT OVERDRIVES
Differential
Input Voltage
− Output Voltage − VVO
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
5
0
−10
−15
10
−5
15
20 mV
VCC± = ±15 V
RE = 2 k to −15 V
TA = 25°C
2 mV
5 mV
100 mV
m
VID
VCC+ = 15 V
RE = 2 k
VO
VCC = −15 V
TEST CIRCUIT FOR FIGURES 6 AND 7
LM211-EP
DIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
TYPICAL CHARACTERISTICS (continued)Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the variousdevices.
Figure 6. Figure 7.
8
Submit Documentation Feedback
www.ti.com
60
40
20
00 5 10
80
100
120
15
VCC± = ±15 V
t 10 s
VID = −10 mV
TA = 25°C
VO − Output Voltage − V
140
160
300
200
100
0
− Output Dissipation − mW
400
500
600
PO
700
800
OUTPUT CURRENT AND DISSIPATION
vs
OUTPUT VOLTAGE
PO (right scale)
IO (left scale)
IO − Output Current and Dissipation − mA
3
2
1
00 5 10
4
5
6
15
TA = 25°C
No Load
VCC+ − Positive Supply V oltage − V
VID = −10 mV
POSITIVE SUPPLY CURRENT
vs
POSITIVE SUPPLY VOLTAGE
ICC+ − Positive Supply Current − mA
VID = 10 mV
−3
−2
−1
00 −5 −10
−4
−5
−6
−15
NEGATIVE SUPPLY CURRENT
vs
NEGATIVE SUPPLY VOLTAGE
VCC − Negative Supply Voltage − V
ICC− − Negative Supply Current − mA
VID = 10 mV or −10 mV
TA = 25°C
No Load
LM211-EPDIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
TYPICAL CHARACTERISTICS (continued)Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the variousdevices.
Figure 8. Figure 9.
Figure 10.
9Submit Documentation Feedback
www.ti.com
APPLICATION INFORMATION
VCC+
39 k
1200 pF
20 k1 k
10 k
20 k
Square-Wave
Output
(fanout to two
Series 54 gates,
or equivalent)
3 k
3 k
VCC+
BALANCE BAL/
STRB
NOTE: If of fset balancing is not used, the BALANCE and BAL/STRB pins should be shorted together.
1 k
BAL/STRB
TTL
Strobe 2N2222
LM211-EP
DIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
Figure 11 through Figure 29 show various applications for the LM211-EP comparator.
Figure 11. 100-kHz Free-Running Multivibrator
Figure 12. Offset Balancing
Figure 13. Strobing
10
Submit Documentation Feedback
www.ti.com
VCC+
Input
VCC
20 k
Output
5 V
1 k
240 k
82 k
47 k
82 k
Output to TTL
Input
(see Note A)
See Note B
5 V
2 k
4.5 k
1 k
Magnetic
Transducer
Output
to TTL
LM211-EPDIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
APPLICATION INFORMATION (continued)
Figure 14. Zero-Crossing Detector
A. Resistor values shown are for a 0-to-30-V logic swing and a 15-V threshold.B. May be added to control speed and reduce susceptibility to noise spikes
Figure 15. TTL Interface With High-Level Logic
Figure 16. Detector for Magnetic Transducer
11Submit Documentation Feedback
www.ti.com
0.1 µF50 k
VCC+ 2 k
100 k
100 k
100 kHz
Output
10 pF
Input
22 k
Output
VCC+
VCC+
1 k
From D/A Network
0.1 µF
Sample
Analog Input
(see Note A)
2N2222 TTL
Strobe
BAL/STRBBALANCE
LM211-EP
DIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
APPLICATION INFORMATION (continued)
Figure 17. 100-kHz Crystal Oscillator
Figure 18. Comparator and Solenoid Driver
A. Typical input current is 50 pA with inputs strobed off.
Figure 19. Strobing Both Input and Output Stages Simultaneously
12
Submit Documentation Feedback
www.ti.com
500 3.9 k
10 k
1.5 µF
+
VCC+
Output
2N2222
2N3708
1 k
3 k
3 k
VCC+ = 5 V
Input
10 k
VCC = −10 V
Output
to MOS
BAL/
STRB
BALANCE
3.9 k
30 k (see Note A)
1.5 µF
+
VCC+ = 5 V
Input
From
TTL
2N2222
2N3708
Output
510
1 k1 k
2N2222
2N2222
2.2 k
1N914
1N914
2.7 k
LM211-EPDIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
APPLICATION INFORMATION (continued)
Figure 20. Low-Voltage Adjustable Reference Supply
Figure 21. Zero-Crossing Detector Driving MOS Logic
A. Adjust to set clamp level
Figure 22. Precision Squarer
13Submit Documentation Feedback
www.ti.com
5 k
0.01 µF
TTL
Output
1 k
1 k
1 k
100
From
TTL
Gate
50 k
Opto Isolator
5 V VCC+ = 5 V
1.5 µF
+
10 k
2 k
VCC+ = 15 V
TL081
Output
Input
1 M
VCC = −15 V
+
15 µF
+
10 k
1 M
VCC+ = 15 V
TL081
Output
Input
VCC = −15 V
2 k+
LM211-EP
DIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
APPLICATION INFORMATION (continued)
Figure 23. Digital Transmission Isolator
Figure 24. Positive-Peak Detector
Figure 25. Negative-Peak Detector
14
Submit Documentation Feedback
www.ti.com
2N2222
2N3708
R1
30 k
(see Note A)
3.9 k
1 k
Output
to TTL
VCC+ = 5 V
1N2175
2N3708
VCC+
Inputs
TTL
Strobe VCC
1 k
BAL/STRB See Note A
LM211-EPDIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
APPLICATION INFORMATION (continued)
A. R1 sets the comparison level. At comparison, the photodiode has less than 5 mV across it, decreasing dark currentby an order of magnitude.
Figure 26. Precision Photodiode Comparator
A. Transient voltage and inductive kickback protection
Figure 27. Relay Driver With Strobe
15Submit Documentation Feedback
www.ti.com
300
VCC+
VCC
100 kOutput
100 k
47
10 k
620
Input
0.1 µF300 620
1
2
BAL/STRB
BAL/STRB
V+
0.22 µF
300 k
620
1
VCC
2
VCC
620
620
620
620
620
39 k
510
510
15 k
15 k
39 k
300 k
Outputs
VCC+
Input
Reference
BAL/STRB
BAL/STRB
LM211-EP
DIFFERENTIAL COMPARATOR WITH STROBES
SLCS140A DECEMBER 2002 REVISED MAY 2006
APPLICATION INFORMATION (continued)
Figure 28. Switching Power Amplifier
Figure 29. Switching Power Amplifiers
16
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM211MDREP ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM211M
LM211QDREP ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM211E
V62/03638-01XE ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM211E
V62/03638-02XE ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM211M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 2
OTHER QUALIFIED VERSIONS OF LM211-EP :
Catalog: LM211
Automotive: LM211-Q1
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM211MDREP SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM211QDREP SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jan-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM211MDREP SOIC D 8 2500 367.0 367.0 35.0
LM211QDREP SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jan-2013
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated