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LM741
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LM741 Operational Amplifier
1 Features 3 Description
The LM741 series are general-purpose operational
1 Overload Protection on the Input and Output amplifiers which feature improved performance over
No Latch-Up When the Common-Mode Range is industry standards like the LM709. They are direct,
Exceeded plug-in replacements for the 709C, LM201, MC1439,
and 748 in most applications.
2 Applications The amplifiers offer many features which make their
Comparators application nearly foolproof: overload protection on
the input and output, no latch-up when the common-
Multivibrators mode range is exceeded, as well as freedom from
DC Amplifiers oscillations.
Summing Amplifiers The LM741C is identical to the LM741 and LM741A
Integrator or Differentiators except that the LM741C has their performance
Active Filters ensured over a 0°C to +70°C temperature range,
instead of 55°C to +125°C.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TO-99 (8) 9.08 mm × 9.08 mm
LM741 CDIP (8) 10.16 mm × 6.502 mm
PDIP (8) 9.81 mm × 6.35 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM741
SNOSC25D MAY 1998REVISED OCTOBER 2015
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Table of Contents
7.3 Feature Description................................................... 7
1 Features.................................................................. 17.4 Device Functional Modes.......................................... 8
2 Applications ........................................................... 18 Application and Implementation .......................... 9
3 Description............................................................. 18.1 Application Information.............................................. 9
4 Revision History..................................................... 28.2 Typical Application ................................................... 9
5 Pin Configuration and Functions......................... 39 Power Supply Recommendations...................... 10
6 Specifications......................................................... 410 Layout................................................................... 11
6.1 Absolute Maximum Ratings ...................................... 410.1 Layout Guidelines ................................................. 11
6.2 ESD Ratings.............................................................. 410.2 Layout Example .................................................... 11
6.3 Recommended Operating Conditions....................... 411 Device and Documentation Support................. 12
6.4 Thermal Information.................................................. 411.1 Community Resources.......................................... 12
6.5 Electrical Characteristics, LM741.............................. 511.2 Trademarks........................................................... 12
6.6 Electrical Characteristics, LM741A ........................... 511.3 Electrostatic Discharge Caution............................ 12
6.7 Electrical Characteristics, LM741C........................... 611.4 Glossary................................................................ 12
7 Detailed Description.............................................. 712 Mechanical, Packaging, and Orderable
7.1 Overview................................................................... 7Information........................................................... 12
7.2 Functional Block Diagram......................................... 7
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (October 2004) to Revision D Page
Added Applications section, Pin Configuration and Functions section, ESD Ratings table, Feature Description
section, Device Functional Modes,Application and Implementation section, Power Supply Recommendations
section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable
Information section ................................................................................................................................................................ 1
Removed NAD 10-Pin CLGA pinout ..................................................................................................................................... 3
Removed obselete M (S0-8) package from the data sheet ................................................................................................... 4
Added recommended operating supply voltage spec ............................................................................................................ 4
Added recommended operating temperature spec................................................................................................................ 4
Changes from Revision C (March 2013) to Revision D Page
Added Applications section, Pin Configuration and Functions section, ESD Ratings table, Feature Description
section, Device Functional Modes,Application and Implementation section, Power Supply Recommendations
section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable
Information section ................................................................................................................................................................ 1
Removed NAD 10-Pin CLGA pinout ..................................................................................................................................... 3
Removed obselete M (S0-8) package from the data sheet ................................................................................................... 4
Added recommended operating supply voltage spec ............................................................................................................ 4
Added recommended operating temperature spec................................................................................................................ 4
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5 Pin Configuration and Functions
LMC Package NAB Package
8-Pin TO-99 8-Pin CDIP or PDIP
Top View Top View
LM741H is available per JM38510/10101
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
INVERTING 2 I Inverting signal input
INPUT
NC 8 N/A No Connect, should be left floating
NONINVERTING 3 I Noninverting signal input
INPUT
OFFSET NULL 1, 5 I Offset null pin used to eliminate the offset voltage and balance the input voltages.
OFFSET NULL
OUTPUT 6 O Amplified signal output
V+ 7 I Positive supply voltage
V– 4 I Negative supply voltage
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
LM741, LM741A ±22
Supply voltage V
LM741C ±18
Power dissipation (4) 500 mW
Differential input voltage ±30 V
Input voltage (5) ±15 V
Output short circuit duration Continuous
LM741, LM741A –50 125
Operating temperature °C
LM741C 0 70
LM741, LM741A 150
Junction temperature °C
LM741C 100
PDIP package (10 seconds) 260 °C
Soldering information CDIP or TO-99 package (10 seconds) 300 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For military specifications see RETS741X for LM741 and RETS741AX for LM741A.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For operation at elevated temperatures, these devices must be derated based on thermal resistance, and Tjmax. (listed under “Absolute
Maximum Ratings”). Tj= TA+ (θjA PD).
(5) For supply voltages less than ±15 V, the absolute maximum input voltage is equal to the supply voltage.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±400 V
(1) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
LM741, LM741A ±10 ±15 ±22
Supply voltage (VDD-GND) V
LM741C ±10 ±15 ±18
LM741, LM741A –55 125
Temperature °C
LM741C 0 70
6.4 Thermal Information LM741
THERMAL METRIC(1) LMC (TO-99) NAB (CDIP) P (PDIP) UNIT
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 170 100 100 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics, LM741(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA= 25°C 1 5 mV
Input offset voltage RS10 kΩTAMIN TATAMAX 6 mV
Input offset voltage TA= 25°C, VS= ±20 V ±15 mV
adjustment range TA= 25°C 20 200
Input offset current nA
TAMIN TATAMAX 85 500
TA= 25°C 80 500 nA
Input bias current TAMIN TATAMAX 1.5 μA
Input resistance TA= 25°C, VS= ±20 V 0.3 2 MΩ
Input voltage range TAMIN TATAMAX ±12 ±13 V
TA= 25°C 50 200
VS= ±15 V, VO= ±10 V, RL2
Large signal voltage gain V/mV
kΩTAMIN TATAMAX 25
RL10 kΩ±12 ±14
Output voltage swing VS= ±15 V V
RL2 kΩ±10 ±13
Output short circuit current TA= 25°C 25 mA
Common-mode rejection ratio RS10 Ω, VCM = ±12 V, TAMIN TATAMAX 80 95 dB
Supply voltage rejection ratio VS= ±20 V to VS= ±5 V, RS10 Ω, TAMIN TATAMAX 86 96 dB
Rise time 0.3 μs
Transient TA= 25°C, unity gain
response Overshoot 5%
Slew rate TA= 25°C, unity gain 0.5 V/μs
Supply current TA= 25°C 1.7 2.8 mA
TA= 25°C 50 85
Power consumption VS= ±15 V TA= TAMIN 60 100 mW
TA= TAMAX 45 75
(1) Unless otherwise specified, these specifications apply for VS= ±15 V, 55°C TA+125°C (LM741/LM741A). For the
LM741C/LM741E, these specifications are limited to 0°C TA+70°C.
6.6 Electrical Characteristics, LM741A(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA= 25°C 0.8 3 mV
Input offset voltage RS50 ΩTAMIN TATAMAX 4 mV
Average input offset voltage 15 μV/°C
drift
Input offset voltage TA= 25°C, VS= ±20 V ±10 mV
adjustment range TA= 25°C 3 30
Input offset current nA
TAMIN TATAMAX 70
Average input offset 0.5 nA/°C
current drift TA= 25°C 30 80 nA
Input bias current TAMIN TATAMAX 0.21 μA
TA= 25°C, VS= ±20 V 1 6
Input resistance MΩ
TAMIN TATAMAX, VS= ±20 V 0.5
TA= 25°C 50
VS= ±20 V, VO= ±15 V, RL2
kΩ
Large signal voltage gain TAMIN TATAMAX 32 V/mV
VS= ±5 V, VO= ±2 V, RL2 kΩ, TAMIN TATAMAX 10
(1) Unless otherwise specified, these specifications apply for VS= ±15 V, 55°C TA+125°C (LM741/LM741A). For the
LM741C/LM741E, these specifications are limited to 0°C TA+70°C.
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Electrical Characteristics, LM741A(1) (continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RL10 kΩ±16
Output voltage swing VS= ±20 V V
RL2 kΩ±15
TA= 25°C 10 25 35
Output short circuit current mA
TAMIN TATAMAX 10 40
Common-mode rejection ratio RS50 Ω, VCM = ±12 V, TAMIN TATAMAX 80 95 dB
Supply voltage rejection ratio VS= ±20 V to VS= ±5 V, RS50 Ω, TAMIN TATAMAX 86 96 dB
Rise time 0.25 0.8 μs
Transient TA= 25°C, unity gain
response Overshoot 6% 20%
Bandwidth (2) TA= 25°C 0.437 1.5 MHz
Slew rate TA= 25°C, unity gain 0.3 0.7 V/μs
TA= 25°C 80 150
Power consumption VS= ±20 V TA= TAMIN 165 mW
TA= TAMAX 135
(2) Calculated value from: BW (MHz) = 0.35/Rise Time (μs).
6.7 Electrical Characteristics, LM741C(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA= 25°C 2 6 mV
Input offset voltage RS10 kΩTAMIN TATAMAX 7.5 mV
Input offset voltage TA= 25°C, VS= ±20 V ±15 mV
adjustment range TA= 25°C 20 200
Input offset current nA
TAMIN TATAMAX 300
TA= 25°C 80 500 nA
Input bias current TAMIN TATAMAX 0.8 μA
Input resistance TA= 25°C, VS= ±20 V 0.3 2 MΩ
Input voltage range TA= 25°C ±12 ±13 V
TA= 25°C 20 200
VS= ±15 V, VO= ±10 V, RL
Large signal voltage gain V/mV
2 kΩTAMIN TATAMAX 15
RL10 kΩ±12 ±14
Output voltage swing VS= ±15 V V
RL2 kΩ±10 ±13
Output short circuit current TA= 25°C 25 mA
Common-mode rejection ratio RS10 kΩ, VCM = ±12 V, TAMIN TATAMAX 70 90 dB
Supply voltage rejection ratio VS= ±20 V to VS= ±5 V, RS10 Ω, TAMIN TATAMAX 77 96 dB
Rise time 0.3 μs
Transient response TA= 25°C, Unity Gain
Overshoot 5%
Slew rate TA= 25°C, Unity Gain 0.5 V/μs
Supply current TA= 25°C 1.7 2.8 mA
Power consumption VS= ±15 V, TA= 25°C 50 85 mW
(1) Unless otherwise specified, these specifications apply for VS= ±15 V, 55°C TA+125°C (LM741/LM741A). For the
LM741C/LM741E, these specifications are limited to 0°C TA+70°C.
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7 Detailed Description
7.1 Overview
The LM74 devices are general-purpose operational amplifiers which feature improved performance over industry
standards like the LM709. It is intended for a wide range of analog applications. The high gain and wide range of
operating voltage provide superior performance in integrator, summing amplifier, and general feedback
applications. The LM741 can operate with a single or dual power supply voltage. The LM741 devices are direct,
plug-in replacements for the 709C, LM201, MC1439, and 748 in most applications.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Overload Protection
The LM741 features overload protection circuitry on the input and output. This prevents possible circuit damage
to the device.
7.3.2 Latch-up Prevention
The LM741 is designed so that there is no latch-up occurrence when the common-mode range is exceeded. This
allows the device to function properly without having to power cycle the device.
7.3.3 Pin-to-Pin Capability
The LM741 is pin-to-pin direct replacements for the LM709C, LM201, MC1439, and LM748 in most applications.
Direct replacement capabilities allows flexibility in design for replacing obsolete parts.
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7.4 Device Functional Modes
7.4.1 Open-Loop Amplifier
The LM741 can be operated in an open-loop configuration. The magnitude of the open-loop gain is typically large
thus for a small difference between the noninverting and inverting input terminals, the amplifier output will be
driven near the supply voltage. Without negative feedback, the LM741 can act as a comparator. If the inverting
input is held at 0 V, and the input voltage applied to the noninverting input is positive, the output will be positive.
If the input voltage applied to the noninverting input is negative, the output will be negative.
7.4.2 Closed-Loop Amplifier
In a closed-loop configuration, negative feedback is used by applying a portion of the output voltage to the
inverting input. Unlike the open-loop configuration, closed loop feedback reduces the gain of the circuit. The
overall gain and response of the circuit is determined by the feedback network rather than the operational
amplifier characteristics. The response of the operational amplifier circuit is characterized by the transfer function.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM741 is a general-purpose amplifier than can be used in a variety of applications and configurations. One
common configuration is in a noninverting amplifier configuration. In this configuration, the output signal is in
phase with the input (not inverted as in the inverting amplifier configuration), the input impedance of the amplifier
is high, and the output impedance is low. The characteristics of the input and output impedance is beneficial for
applications that require isolation between the input and output. No significant loading will occur from the
previous stage before the amplifier. The gain of the system is set accordingly so the output signal is a factor
larger than the input signal.
8.2 Typical Application
Figure 1. LM741 Noninverting Amplifier Circuit
8.2.1 Design Requirements
As shown in Figure 1, the signal is applied to the noninverting input of the LM741. The gain of the system is
determined by the feedback resistor and input resistor connected to the inverting input. The gain can be
calculated by Equation 1:
Gain = 1 + (R2/R1) (1)
The gain is set to 2 for this application. R1 and R2 are 4.7-k resistors with 5% tolerance.
8.2.2 Detailed Design Procedure
The LM741 can be operated in either single supply or dual supply. This application is configured for dual supply
with the supply rails at ±15 V. The input signal is connected to a function generator. A 1-Vpp, 10-kHz sine wave
was used as the signal input. 5% tolerance resistors were used, but if the application requires an accurate gain
response, use 1% tolerance resistors.
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Typical Application (continued)
8.2.3 Application Curve
The waveforms in Figure 2 show the input and output signals of the LM741 non-inverting amplifier circuit. The
blue waveform (top) shows the input signal, while the red waveform (bottom) shows the output signal. The input
signal is 1.06 Vpp and the output signal is 1.94 Vpp. With the 4.7-kΩresistors, the theoretical gain of the system
is 2. Due to the 5% tolerance, the gain of the system including the tolerance is 1.992. The gain of the system
when measured from the mean amplitude values on the oscilloscope was 1.83.
Figure 2. Waveforms for LM741 Noninverting Amplifier Circuit
9 Power Supply Recommendations
For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines, a 0.1-µF
capacitor is recommended and should be placed as close as possible to the LM741 power supply pins.
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10 Layout
10.1 Layout Guidelines
As with most amplifiers, take care with lead dress, component placement, and supply decoupling in order to
ensure stability. For example, resistors from the output to an input should be placed with the body close to the
input to minimize pick-up and maximize the frequency of the feedback pole by minimizing the capacitance from
the input to ground. As shown in Figure 3, the feedback resistors and the decoupling capacitors are located close
to the device to ensure maximum stability and noise performance of the system.
10.2 Layout Example
Figure 3. LM741 Layout
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11 Device and Documentation Support
11.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM741C-MWC ACTIVE WAFERSALE YS 0 1 Green (RoHS
& no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85
LM741CH ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI 0 to 70 ( LM741CH ~
LM741CH)
LM741CH/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS
& no Sb/Br) Call TI Level-1-NA-UNLIM 0 to 70 ( LM741CH ~
LM741CH)
LM741CN/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM
741CN
LM741H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LM741H ~ LM741H)
LM741H/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS
& no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 ( LM741H ~ LM741H)
LM741J ACTIVE CDIP NAB 8 40 TBD Call TI Call TI -55 to 125 LM741J
U5B7741312 ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LM741H ~ LM741H)
U5B7741393 ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI 0 to 70 ( LM741CH ~
LM741CH)
U9T7741393 OBSOLETE PDIP P 8 TBD Call TI Call TI 0 to 70 LM
741CN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
NAB0008A
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J08A (Rev M)
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
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