SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 FEATURES APPLICATIONS D D D D D D D D D D D D D Programmable Slope Compensation Internal Soft-Start on the UCC38083/4 Cycle-by-Cycle Current Limiting Low Start-Up Current of 120 A and 1.5 mA Typical Run Current Single External Component Oscillator Programmable from 50 kHz to 1 MHz High-Current Totem-Pole Dual Output Stage Drives Push-Pull Configuration with 1-A Sink and 0.5-A Source Capability Current Sense Discharge Transistor to Improve Dynamic Response Internally Trimmed Bandgap Reference Undervoltage Lockout with Hysteresis BASIC APPLICATION V IN POWER TRANSFORMER VDD UCC3808x CTRL OUTA RT OUTB CS R SET CF The UCC38083/4/5/6 is a family of BiCMOS pulse width modulation (PWM) controllers for dc-to-dc or off-line fixed-frequency current-mode switching power supplies. The dual output stages are configured for the push-pull topology. Both outputs switch at half the oscillator frequency using a toggle flip-flop. The dead time between the two outputs is typically 110 ns, limiting each output's duty cycle to less than 50%. The new UCC3808x family is based on the UCC3808A architecture. The major differences include the addition of a programmable slope compensation ramp to the CS signal and the removal of the error amplifier. The current flowing out of the ISET pin through an external resistor is monitored internally to set the magnitude of the slope V OUT compensation function. This device also includes an internal discharge transistor from the CS pin to ground, which is activated at each clock cycle after the pulse is terminated. This discharges any filter capacitance on the CS pin during each cycle and helps minimize filter capacitor values and current sense delay. The UCC38083 and the UCC38085 devices have the turn-on/off thresholds of 12.5 V / 8.3 V, while the UCC38084 and the UCC38086 has the turn-on/off thresholds of 4.3 V / 4.1 V. Each device is offered in 8-pin TSSOP (PW), 8-pin SOIC (D) and 8-pin PDIP (P) packages. GND RT DESCRIPTION The UCC38083 and the UCC38084 devices have a typical soft-start interval time of 3.5 ms while the UCC38085 and the UCC38086 has less than 100 s for applications where internal soft-start is not desired. RF ISET High-Efficiency Switch-Mode Power Supplies Telecom dc-to-dc Converters Point-of-Load or Point-of-Use Power Modules Low-Cost Push-Pull and Half-Bridge Applications RS FEEDBACK UDG-01080 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- Copyright 2002-2009, Texas Instruments Incorporated www.ti.com 1 SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 ORDERING INFORMATION THERMAL RESISTANCE TABLE PACKAGE jc(C/W) SOIC-8 (D) 42 PDIP-8 (P) 50 32(2) ja(C/W) 84 to 160(1) 110(1) 232 to 257(2) NOTES: (1) Specified ja (junction to ambient) is for devices mounted to 5-inch2 FR4 PC board with one ounce copper where noted. When resistance range is given, lower values are for 5 inch2 aluminum PC board. Test PWB was 0.062 inch thick and typically used 0.635-mm trace widths for power packages and 1.3-mm trace widths for non-power packages with a 100-mil x 100-mil probe land area at the end of each trace. (2). Modeled data. If value range given for ja, lower value is for 3x3 inch. 1 oz internal copper ground plane, higher value is for 1x1-inch. ground plane. All model data assumes only one trace for each non-fused lead. TSSOP-8 (PW) AVAILABLE OPTIONS INTERNAL SOFT START TA 3.5 ms -40C to 85C 75 s 3.5 ms 0C to 70C 75 s UVLO PACKAGES ON OFF SOIC-8 (D) PDIP-8 (P) TSSOP-8 (PW) 12.5 V 8.3 V UCC28083D UCC28083P UCC28083PW 4.3 V 4.1 V UCC28084D UCC28084P UCC28084PW 12.5 V 8.3 V UCC28085D UCC28085P UCC28085PW 4.3 V 4.1 V UCC28086D UCC28086P UCC28086PW 12.5 V 8.3 V UCC38083D UCC38083P UCC38083PW 4.3 V 4.1 V UCC38084D UCC38084P UCC38084PW 12.5 V 8.3 V UCC38085D UCC38085P UCC38085PW 4.3 V 4.1 V UCC38086D UCC38086P UCC38086PW The D and PW packages are available taped and reeled. Add R suffix to device type, e.g. UCC28083DR (2500 devices per reel) or UCC38083PWR (2000 devices per reel). PW PACKAGE (TOP VIEW) D OR P PACKAGE (TOP VIEW) CTRL ISET CS RT 2 1 8 2 7 3 6 4 5 VDD OUTA OUTB GND OUTA VDD CTRL ISET www.ti.com 1 2 3 4 8 7 6 5 OUTB GND RT CS SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 absolute maximum ratings over operating free-air temperature (unless otherwise noted) Supply voltage, VDD (IDD < 10 mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V Supply current, IDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Sink current (peak): OUTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 A OUTB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 A Source current (peak): OUTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 A OUTB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 A Analog inputs: CTRL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to VDD +0.3 V CS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to VDD +0.3 V, not to exceed 6 V RSET (minimum) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >5 k RT (-100 A < IRT < 100 A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 2.0 V Power dissipation at TA = 25C (P package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W Power dissipation at TA = 25C (D package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 650 mW Power dissipation at TA = 25C (PW package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mW Junction operating temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to 150C Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Lead temperature (soldering 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. Currents are positive into, and negative out of the specified terminal. electrical characteristics over recommended operating virtual junction temperature range, VDD = 10 V (See Note 1),1-F capacitor from VDD to GND, RT = 165 k, RF = 1 k, CF = 220 pF, RSET = 50 k, TA = -40C to 85C for UCC2808x, TA = 0C to 70C for UCC3808x, TA = TJ (unless otherwise noted) overall PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Start-up current VDD < UVLO start threshold voltage 120 200 A Supply current CTRL = 0 V, See Note 1 1.5 2.5 mA MIN TYP MAX CS = 0 V, undervoltage lockout PARAMETER TEST CONDITIONS UCC38083/5 Start threshold voltage Minimum operating voltage after start Hysteresis voltage 11.5 12.5 13.5 UCC38084/6 See Note 1 4.1 4.3 4.5 UCC38083/5 7.6 8.3 9.0 UCC38084/6 3.9 4.1 4.3 UCC38083/5 3.5 4.2 5.1 UCC38084/6 0.1 0.2 0.3 UNITS V oscillator MIN TYP MAX UNITS Frequency PARAMETER 2 x f(OUTA) TEST CONDITIONS 180 200 220 kHz Voltage amplitude See Note 2 1.4 Oscillator fall time (dead time) RT pin voltage 1.2 www.ti.com 1.5 1.6 V 110 220 ns 1.5 1.6 V 3 SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 electrical characteristics over recommended operating virtual junction temperature range, VDD = 10 V (See Note 1),1-F capacitor from VDD to GND, RT = 165 k, RF = 1 k, CF = 220 pF, RSET = 50 k, TA = -40C to 85C for UCC2808x, TA = 0C to 70C for UCC3808x, TA = TJ (unless otherwise noted) current sense PARAMETER TEST CONDITIONS Gain See Note 3 Maximum input signal voltage CTRL = 5 V, See Note 4 CS to output delay time CTRL = 3.5 V, 0 mV CS 600 mV CS = 0.5 V, See Note 5 RT = 2.0 V, Source current MIN TYP MAX 1.9 2.2 2.5 0.47 0.52 0.57 V 100 200 ns -200 Sink current Overcurrent threshold voltage CTRL to CS offset voltage UNITS V/V nA 3 7 12 mA 0.70 0.75 0.80 V CS = 0 V, 25C 0.55 0.70 0.90 V CS = 0 V 0.37 0.70 1.10 V MIN TYP MAX UNITS 48% 49% 50% pulse width modulation PARAMETER TEST CONDITIONS Maximum duty cycle Measured at OUTA or OUTB, See Note 7 Minimum duty cycle CTRL = 0 V 0% output PARAMETER TEST CONDITIONS Low-level output voltage (OUTA or OUTB) MIN TYP MAX 0.5 1.0 0.5 1.0 High-level output voltage (OUTA or OUTB) IOUT = 100 mA IOUT = -50 mA, Rise time CLOAD = 1 nF 25 60 Fall time CLOAD = 1 nF 25 60 MIN TYP MAX (VDD - VOUT), See Note 6 UNITS V ns soft-start PARAMETER TEST CONDITIONS UNITS OUTA/OUTB soft-start interval time, UCC38083/4 CTRL = 1.8 V, CS = 0 V, Duty cycle from 0 to full, See Note 8 1.3 3.5 8.5 ms OUTA/OUTB soft-start interval time, UCC38085/6 CTRL = 1.8 V, CS = 0 V, Duty cycle from 0 to full, See Note 8 30 75 110 s TEST CONDITIONS MIN TYP MAX UNITS IRAMP, peak ISET, peak = 30 A, Full duty cycle NOTE 1: For UCCx8083/5, set VDD above the start threshold before setting to 10 V. NOTE 2: Measured at ISET pin. DV CTRL NOTE 3: Gain is defined by A + , 0 VCS 0.4 V. DV 125 150 175 A slope compensation PARAMETER CS NOTE 4: NOTE 5: NOTE 6: NOTE 7: NOTE 8: 4 Measured at trip point of latch with CS ramped from 0.4 V to 0.6 V. This internal current sink on the CS pin is designed to discharge and external filter capacitor. It is not intended to be a dc sink path. Not 100% production tested. Ensured by design and also by the rise time test. For devices in PW package, parameter tested at wafer probe. Ensured by design. www.ti.com SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 functional block diagram Soft Start and Fault Latch CTRL 1 S Iss Bias/UVLO VREF Q 0.5V Slope Circuit ISLOPE 8 R Vdd-1 VDD S CT + R Css ISET Q I SLOPE = 5 x I SET 2 CS Circuitry 0.75V PWM Comparator/Latch Output Driver 7 OUTA 80 k S 60 k 0.5V CS Q Q T R 0.3 V Q 3 6 OUTB Oscillator 1.5V 1.5V S Q I CT R RT 4 5 CT 0.2V GND UDG-01081 Terminal Functions TERMINAL NAME PACKAGE I/O DESCRIPTION D OR P CS 3 I The current-sense input to the PWM comparator, the cycle-by-cycle peak current comparator, and the overcurrent comparator. The overcurrent comparator is only intended for fault sensing. Exceeding the overcurrent threshold causes a soft-start cycle. An internal MOSFET discharges the current-sense filter capacitor to improve dynamic performance of the power converter. CTRL 1 I Error voltage input to PWM comparator. GND 5 - Reference ground and power ground for all functions. Due to high currents, and high-frequency operation of the IC, a low-impedance circuit board ground plane is highly recommended. Current selection for slope compensation. ISET 2 I OUTA 7 O OUTB 6 O RT 4 I Programs the oscillator. VDD 8 I Power input connection. Alternating high-current output stages. www.ti.com 5 SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 detailed pin descriptions CTRL: The error voltage is typically generated by a secondary-side error amplifier and transmitted to the primary-side referenced UCC3808x by means of an opto-coupler. CTRL has an internal divider ratio of 0.45 to maintain a usable range with the minimum VDD of 4.1 V. The UCC38083/UCC38084 family features a built-in full-cycle soft start while the UCC38085/6 does not. For the UCC38083/4, soft-start is implemented as a clamp at the input to the PWM comparator. This causes the output pulses to start near 0% duty cycle and increase until the clamp exceeds the CTRL voltage. ISET: Program the slope compensation current ramp by connecting a resistor, RSET, from ISET to ground. The voltage of the ISET pin tracks the 1.5-V internal oscillator ramp, as shown in Figure 1. VCS VDD 10 k I RAMP, peak = 5 x ISET, peak IRAMP UCC38083 RF 1 k I RAMP 1 CTRL VDD 8 2 ISET OUTA 7 3 CS OUTB 6 4 RT GND 5 ISET 1 F OUTA 220 F RT 165 k OUTB Figure 1. Full Duty Cycle Output The compensating current source, ISLOPE, at the CS pin is proportional to the ISET current, according to the relation: I SLOPE +5 I SET (1) The ramping current due to ISLOPE develops a voltage across the effective filter impedance that is normally connected from the current sense resistor to the CS input. In order to program a desired compensating slope with a specific peak compensating ramp voltage at the CS pin, use the RSET value in the following equation: RSET + V Where V OSC(peak) OSC(peak) 5 RF RAMP VOLTAGE HEIGHT (2) + 1.5 V Notice that the PWM Latch drives an internal MOSFET that will discharge an external filtering capacitor on the CS pin. Thus, ISLOPE will appear to terminate when the PWM comparator or the cycle-by-cycle current limit comparator sets the PWM latch. The actual compensating slope is not affected by premature termination of the switching cycle. 6 www.ti.com SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 detailed pin descriptions (continued) OUTA and OUTB: Alternating high-current output stages. Both stages are capable of driving the gate of a power MOSFET. Each stage is capable of 500-mA peak-source current, and 1-A peak-sink current. The output stages switch at half the oscillator frequency, in a push-pull configuration. When the voltage on the internal oscillator capacitor is rising, one of the two outputs is high, but during fall time, both outputs are off. This dead time between the two outputs, along with a slower output rise time than fall time, ensures that the two outputs cannot be on at the same time. This dead time is typically 110 ns. The high-current output drivers consist of MOSFET output devices, which switch from VDD to GND. Each output stage also provides a very low impedance to overshoot and undershoot. This means that in many cases, external Schottky clamp diodes are not required. RT: The oscillator programming pin. The oscillator features an internal timing capacitor. An external resistor, RT, sets a current from the RT pin to ground. Due to variations in the internal CT, nominal VRT of 1.5 V can vary from 1.2 V to 1.6 V Selecting RT as shown programs the oscillator frequency: RT + 1 28.7 1 * 2.0 10 -12 f OSC 10 -7 (3) where fOSC is in Hz, resistance in . The recommended range of timing resistors is between 25 k and 698 k. For best performance, keep the timing resistor lead from the RT pin to GND (pin 5) as short as possible. 1.5 V I 1.5 V I RT S Q CT R OSCILLATOR 4 0.2 V CT R OUTPUT T Approximate Frequency + 28.7 10 -12 1 R T ) 2.0 10 -7 UDG-01083 Figure 2. Block Diagram for Oscillator VDD: The power input connection for this device. Although quiescent VDD current is very low, total supply current may be higher, depending on OUTA and OUTB current, and the programmed oscillator frequency. Total VDD current is the sum of quiescent VDD current and the average OUT current. Knowing the operating frequency and the MOSFET gate charge (QG), average OUT current can be calculated from: I OUT +Q G f OSC (4) where f is the oscillator frequency. To prevent noise problems, bypass VDD to GND with a ceramic capacitor as close to the chip as possible along with an electrolytic capacitor. A 1-F decoupling capacitor is recommended. www.ti.com 7 SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 APPLICATION INFORMATION The following application circuit shows an isolated 12-VIN to 2.5 VOUT push-pull converter with scalable output power (20 W to 200 W). Note that the pinout shown is for SOIC-8 and PDIP-8 packages. typical application V O= 2.2 V TO 3.3 V ADJUSTABLE VIN = 12 V +/-20%V SR DRIVE 1 F 8 VDD 4.7 7 OUTA RT 4 UCC3808x 4.7 6 6 OUTB RF 1 k RS 3 CS CTRL 1 GND ISET 5 2 CF 220 pF 5 165 k 4 1 2 3 TL431 RSET UDG-01084 8 www.ti.com SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 APPLICATION INFORMATION operational waveforms Figure 3 illustrates how the voltage ramp is effectively added to the voltage across the current sense element VCS, to implement slope compensation. OUTA OUTB VRS ADDED RAMP VOLTAGE VCS, Pin 3 UDG-01085 Figure 3. Typical Slope Compensation Waveforms at 80% Duty Cycle In Figure 3, OUTA and OUTB are shown at a duty cycle of 80%, with the associated voltage VRS across the current sense resistor of the primary push-pull power MOSFETs. The current flowing out of CS generates the ramp voltage across the filter resistor RF that is positioned between the power current sense resistor and the CS pin. This voltage is effectively added to VRS to provide slope compensation at VCS, pin 3. A capacitor CF is also recommended to filter the waveform at CS. www.ti.com 9 SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 layout considerations To prevent noise problems, bypass VDD to GND with a ceramic capacitor as close to the chip as possible along with an electrolytic capacitor. A 1-F decoupling capacitor is recommended. Use a local ground plane near the small signal pins (CTRL, ISET, CS and RT) of the IC for shielding. Connect the local ground plane to the GND pin with a single trace. Do not extend the local ground plane under the power pins (VDD, OUTA, OUTB and GND). Instead, use signal return traces to the GND pin for ground returns on the side of the integrated circuit with the power pins. For best performance, keep the timing resistor lead from RT pin (pin 4) to GND (pin 5) as short as possible. special layout considerations for the TSSOP package Due to the different pinout and smaller lead pitch of the TSSOP package, special attention must be paid to minimize noise problems. The pinout is different because the device had to be rotated 90 to fit into the smaller TSSOP package. For example, the two output pins are now on opposite sides of the package. The traces should not run under the package together as they will couple switching noise into analog pins. Another common problem is when RT and OUTB (pins 6 and 8) are routed together for some distance even though they are not immediate side by side pins. Because of this, when OUTB rises, a voltage spike of upto 400 mV can couple into the RT. This spike causes the internal charge current into CT to be turned off momentarily resulting in lower duty cycle. It is also important that note that the RT pin voltage cannot be stabilized with a capacitor. The RT pin is just a dc voltage to program the internal CT. Instead, keep the OUTB and RT runs short and far from each other and follow the printed wiring board layout suggestions above to fix the problem. reference design A reference design is discussed in 50-W Push-Pull Converter Reference Design Using the UCC38083, TI Literature Number SLUU135. This design controls a push-pull synchronous rectified topology with input range of 18 V to 35 V (24 nominal) and 3.3-V output at 15 A. The schematic is shown in Figure 5 and the board layout for the reference design is shown in Figure 4. Refer to the document for further details. Figure 4. Reference Design Layout 10 www.ti.com www.ti.com VCC See Note 2 2OUT 1OUT REG_OUT 2IN 1IN GND REG_IN 3 1 4 2 Note 1. C28, R25, and D12 accelerate the control to the secondary side feedback at start-up and prevent output voltage overshoot. Note 2. Components used for the UCC38085 only. + 5 7 8 6 + + SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 APPLICATION INFORMATION Figure 5. Reference Design Schematic 11 SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 TYPICAL CHARACTERISTICS OSCILLATOR FREQUENCY vs TEMPERATURE OSCILLATOR FREQUENCY vs TIMING RESISTANCE 220 1200 215 T = 85C VDD = 15 V 1000 RT = 165 k RF= 1 k CF = 220 k RSET = 50 k Frequency - kHz 800 Frequency - kHz 210 T = 25C VDD = 10 V 600 400 205 200 195 190 200 T = 40C VDD = 6 V 185 180 0 10 100 -50 1000 0 25 50 75 100 125 Temperature - C RT - Timing Resistance - k Figure 6 Figure 7 IDD vs OSCILLATOR FREQUENCY, (NO LOAD) IDD vs OSCILLATOR FREQUENCY, 1 nF LOAD 25 12 VDD = 14 V 10 20 8 IDD - mA 15 IDD - mA -25 VDD = 10 V 6 10 VDD = 14 V VDD = 10 V VDD = 6 V 4 VDD = 6 V 5 2 0 0 10 12 100 1000 10 100 Frequency - kHz Frequency - kHz Figure 8 Figure 9 www.ti.com 1000 SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 TYPICAL CHARACTERISTICS DEAD TIME vs TIMING RESISTANCE OVER VDD DEAD TIME vs TEMPERATURE 200 160 180 160 VDD = 6 V* T = 85C T = 25C RT = 165 k RF= 1 k CF = 220 k RSET = 50 k 140 120 Dead Time - ns VDD = 10 V Dead Time - ns VDD = 6 V* 140 120 100 VDD = 14 V 80 60 VDD = 14 V T = -40C 100 80 60 40 40 20 20 * UCCx8084/6, only 0 0 10 1000 100 -50 -25 0 25 Figure 10 100 125 Figure 11 CONTROL TO CS OFFSET vs TEMPERATURE RAMP HEIGHT vs VDD 0.6 2.0 TA = 25C 1.8 (OC Clamped) RSET = 10 k 0.5 1.6 VCS = 0.40 V 1.4 RSET = 18 k 0.4 VPK(cs) - V VCTRL - Control Voltage - V 75 50 Temperature - C RT - Timing Resistance - k 1.2 1.0 0.8 0.3 0.2 0.6 RSET = 50 k 0.4 VCS = 0 V 0.1 RSET = 100 k 0.2 0 0.0 -50 -25 0 25 50 75 100 125 Temperature - C 0 10 5 15 VDD - Volts Figure 13 Figure 12 www.ti.com 13 SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 TYPICAL CHARACTERISTICS RAMP HEIGHT vs RT RAMP HEIGHT vs TEMPERATURE 0.7 0.6 TA = 25C RSET = 10 k 0.6 0.5 (OC Clamped) VPK(cs) - V 0.4 VPK(cs) - V RSET = 10 k 0.5 (OC Clamped) RSET = 18 k 0.3 0.4 0.3 0.2 0.2 RSET = 50 k RSET = 18 k RSET = 50 k 0.1 0.1 RSET = 100 k RSET = 100 k 0 0.0 100 10 1000 -50 -25 0 25 50 75 100 125 Temperature - C RT - k Figure 14 Figure 15 SOFT START vs TEMPERATURE SOFT START vs TEMPERATURE 6 100 UCCx8085 AND UCCx8086 UCCx8083 AND UCCx8084 95 90 Soft Start Internal - s Soft Start Internal - ms 5 4 3 2 85 80 75 70 65 60 1 55 0 -50 50 -25 0 25 50 75 100 125 Temperature -C -25 0 25 50 Temperature - C Figure 16 14 -50 Figure 17 www.ti.com 75 100 125 SLUS488E - SEPTEMBER 2002 - REVISED JULY 2009 TYPICAL CHARACTERISTICS CS TO OUTX DELAY TIME vs TEMPERATURE 150 140 CS Prop Delay - ns 130 120 110 100 90 80 70 60 50 -50 -25 0 25 50 75 100 125 Temperature - C Figure 18 RELATED PRODUCTS UCC3808, 8-Pin Low Power Current Mode Push-Pull PWM, (SLUS168) UCC3808A, 8-Pin Low-Power Current-Mode Push-Pull PWM, (SLUS456) UCC3806, Low Power, Dual Output, Current Mode PWM Controller, (SLUS272) Table 1. 8-Pin Push-Pull PWM Controller Family Feature Comparison UVLO On UVLO Off CS Discharge FET Error Amplifier Programmable Slope Compensation Internal Softstart 12.5 V 8.3 V Yes No Yes Yes UCC38084 4.3 V 4.1 V Yes No Yes Yes UCC38085 12.5 V 8.3 V Yes No Yes No UCC38086 4.3 V 4.1 V Yes No Yes No UCC3808A-1 12.5 V 8.3 V Yes Yes No Yes UCC3808A-2 4.3 V 4.1 V Yes Yes No Yes UCC3808-1 12.5 V 8.3 V No Yes No Yes UCC3808-2 4.3 V 4.1 V No Yes No Yes Part Number UCC38083 www.ti.com 15 PACKAGE OPTION ADDENDUM www.ti.com 30-Jul-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) UCC28083D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28083DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28083DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28083DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28083P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC28083PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC28083PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC28083PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC28084D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28084DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28084DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28084DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28084P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC28084PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC28084PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC28084PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC28084PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 30-Jul-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) UCC28084PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC28085D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28085DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28085DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28085DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28085P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC28085PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC28085PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC28085PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC28086D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28086DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28086DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28086DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC28086P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC28086PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC28086PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC28086PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC28086PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 2 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 30-Jul-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) UCC28086PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC38083D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38083DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38083DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38083DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38083P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC38083PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC38084D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38084DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38084DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38084DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38084P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC38084PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC38084PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC38084PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC38084PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC38084PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC38085D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 3 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 30-Jul-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp UCC38085DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38085P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC38085PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC38086D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38086DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38086DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38086DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC38086P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC38086PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 4 PACKAGE OPTION ADDENDUM www.ti.com 30-Jul-2011 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 5 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device UCC28083DR Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC28084DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC28084PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC28085DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC28086DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC28086PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC38083DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC38084DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC38084PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC38086DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC28083DR SOIC D 8 2500 340.5 338.1 20.6 UCC28084DR SOIC D 8 2500 340.5 338.1 20.6 UCC28084PWR TSSOP PW 8 2000 367.0 367.0 35.0 UCC28085DR SOIC D 8 2500 340.5 338.1 20.6 UCC28086DR SOIC D 8 2500 340.5 338.1 20.6 UCC28086PWR TSSOP PW 8 2000 367.0 367.0 35.0 UCC38083DR SOIC D 8 2500 340.5 338.1 20.6 UCC38084DR SOIC D 8 2500 340.5 338.1 20.6 UCC38084PWR TSSOP PW 8 2000 367.0 367.0 35.0 UCC38086DR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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