LP2950CDT-3.3 - NATIONAL SEMICONDUCTOR

SHUTDOWN

COUT

2.2 µF

LP2951

SHUTDOWN

GND

OUT

ERROR

VOUT VIN

CIN

1 µF

SENSE

VTAP

FEEDBACK

VFEEDBACK

330 kVOUT

VIN

CIN

1 µF

OUT

GND

IN COUT

2.2 µF

LP2950

VOUT

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LP2950-N

LP2951-N

SNVS764Q –JANUARY 2000–REVISED DECEMBER 2017

LP295x-N Series of Adjustable Micropower Voltage Regulators

1 Features

1• Input Voltage Range: 2.3 V to 30 V

• 5-V, 3-V, and 3.3-V Output Voltage Versions

Available

• High Accuracy Output Voltage

• Ensured 100-mA Output Current

• Extremely Low Quiescent Current

• Low Dropout Voltage

• Extremely Tight Load and Line Regulation

• Very Low Temperature Coefficient

• Use as Regulator or Reference

• Needs Minimum Capacitance for Stability

• Current and Thermal Limiting

• Stable With Low-ESR Output Capacitors (10 mΩ

to 6 Ω)

• LP2951-N Versions Only:

– Error Flag Warns of Output Dropout

– Logic-Controlled Electronic Shutdown

– Output Programmable From 1.24 V to 29 V

2 Applications

• High-Efficiency Linear Regulator

• Regulator with Undervoltage Shutdown

• Low Dropout Battery-powered Regulator

• Snap-ON/Snap-OFF Regulator

space

LP2951 Simplified Schematic

3 Description

The LP2950-N and LP2951-N are micropower

voltage regulators with very low quiescent current

(75 µA typical) and very low dropout voltage (typical

40 mV at light loads and 380 mV at 100 mA). They

are ideally suited for use in battery-powered systems.

Furthermore, the quiescent current of the device

increases only slightly in dropout, prolonging battery

life.

Careful design of the LP2950-N/LP2951-N has

minimized all contributions to the error budget. This

includes a tight initial tolerance (0.5% typical),

extremely good load and line regulation (0.05%

typical) and a very low output voltage temperature

coefficient, making the part useful as a low-power

voltage reference.

One such feature is an error flag output which warns

of a low output voltage, often due to falling batteries

on the input. It may be used for a power-on reset. A

second feature is the logic-compatible shutdown input

which enables the regulator to be switched on and

off. Also, the part may be pin-strapped for a 5-V, 3-V,

or 3.3-V output (depending on the version), or

programmed from 1.24 V to 29 V with an external

pair of resistors.

The LP2950-N is available in the surface-mount TO-

252 package and in the popular 3-pin TO-92 package

for pin-compatibility with older 5-V regulators. The 8-

pin LP2951-N is available in plastic, ceramic dual-in-

line, WSON, or metal can packages and offers

additional system functions.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LP2950-N TO-92 (3) 4.30 mm × 4.30 mm

TO-252 (3) 9.91 mm × 6.58 mm

LP2951-N

SOIC (8) 4.90 mm × 3.91 mm

VSSOP (8) 3.00 mm × 3.00 mm

WSON (8) 4.00 mm × 4.00 mm

PDIP (8) 9.81 mm × 6.35 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

LP2950-N Simplified Schematic

LP2950-N

LP2951-N

SNVS764Q –JANUARY 2000–REVISED DECEMBER 2017

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Voltage Options ..................................................... 3

6 Pin Configuration and Functions......................... 4

7 Specifications......................................................... 5

7.1 Absolute Maximum Ratings ...................................... 5

7.2 ESD Ratings.............................................................. 5

7.3 Recommended Operating Conditions....................... 5

7.4 Thermal Information: LP2950-N................................ 6

7.5 Thermal Information: LP2951-N................................ 6

7.6 Electrical Characteristics........................................... 7

7.7 Typical Characteristics............................................ 10

8 Detailed Description............................................ 16

8.1 Overview................................................................. 16

8.2 Functional Block Diagrams ..................................... 16

8.3 Feature Description................................................. 17

8.4 Device Functional Modes........................................ 18

9 Application and Implementation ........................ 19

9.1 Application Information............................................ 19

9.2 Typical Applications ................................................ 20

10 Power Supply Recommendations ..................... 32

11 Layout................................................................... 32

11.1 Layout Guidelines ................................................. 32

11.2 Layout Example .................................................... 32

11.3 WSON Mounting................................................... 33

12 Device and Documentation Support................. 34

12.1 Documentation Support ....................................... 34

12.2 Related Links ........................................................ 34

12.3 Community Resources.......................................... 34

12.4 Trademarks........................................................... 34

12.5 Electrostatic Discharge Caution............................ 34

12.6 Glossary................................................................ 34

13 Mechanical, Packaging, and Orderable

Information........................................................... 34

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision P (May 2016) to Revision Q Page

• Changed LP2951-N ESD parameter pin references and added SENSE pin row to LP2951-N ESD parameter in ESD

Ratings table........................................................................................................................................................................... 5

Changes from Revision O (December 2014) to Revision P Page

• Added rows to ESD Ratings table to differentiate values for pins 3 and 7 of the LP2951-N device...................................... 5

• Added footnotes 2 and 3 to both Thermal Information tables ............................................................................................... 6

Changes from Revision N (May 2013) to Revision O Page

• Added Device Information and ESD Rating tables, Feature Description,Device Functional Modes,Application and

Implementation,Power Supply Recommendations,Layout,Device and Documentation Support, and Mechanical,

Packaging, and Orderable Information sections; moved some curves to Application Curves section; update pin

names; change package nomenclature from National to TI .................................................................................................. 1

Changes from Revision M (April 2013) to Revision N Page

• Changed layout of National Data Sheet to TI format ............................................................................................................ 1

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5 Voltage Options

DEVICE NUMBER PACKAGE VOLTAGE OPTION (V)

LP2950-N

TO-92 (LP) 3 (±0.5%, ±1 %)

3.3 (±0.5%, ±1 %)

5 (±0.5%, ±1 %)

TO-252 (NDP) 3 (±1 %)

3.3 (±1%)

5 (±1%)

LP2951-N

SOIC (D) 3 (±0.5%, ±1%)

3.3 (±0.5%, ±1%)

5 (±0.5%, ±1%)

VSSOP (DGK) 3 (±0.5%, ±1%)

3.3 (±0.5%, ±1%)

5 (±0.5%, ±1%)

WSON (NGT) 3 (±0.5%, ±1%)

3.3 (±0.5%, ±1%)

5 (±0.5%, ±1%)

PDIP (P) 5 (±0.5%, ±1%)

OUT

SENSE

SHUTDOWN

GND

VTAP

FEEDBACK

ERROR

DAP

4 5

LP2950-N

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6 Pin Configuration and Functions

LP Package

3-Pin TO-92

Bottom View

P, D, DGK Packages

8-Pin PDIP, SOIC, VSSOP

Top View

NDP Package

3-Pin TO-252

Front View

NGT Package

8-Pin WSON

Top View

Connect DAP to GND at device pin 4.

Pin Functions: LP2950-N

I/O DESCRIPTION

NAME LP2950

LP NDP

GND 2 2 — Ground

IN 3 1 I Input supply voltage

OUT 1 3 O Regulated output voltage

Pin Functions: LP2951-N

I/O DESCRIPTION

NAME LP2951

D, DGK, P NGT

ERROR 5 5 O Error output

FEEDBACK 7 7 I Voltage feedback input

GROUND 4 4 — Ground

IN 8 8 I Input supply voltage

OUT 1 1 O Regulated output voltage

SENSE 2 2 I Output voltage sense

SHUTDOWN 3 3 I Disable device

VTAP 6 6 O Internal resistor divider

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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3) May exceed input supply voltage.

(4) When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be

diode-clamped to ground.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)

MIN MAX UNIT

Input supply voltage - SHUTDOWN input voltage error comparator output voltage(3) –0.3 30 V

FEEDBACK input voltage(3)(4) –1.5 30 V

Power dissipation Internally Limited

Junction temperature, TJ150

°C

Soldering dwell time, temperature Wave 4 seconds, 260

Infrared 10 seconds, 240

Vapor phase 75 seconds, 219

Storage temperature, Tstg –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings VALUE UNIT

LP2950-N

V(ESD) Electrostatic

discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V

LP2951-N

V(ESD) Electrostatic

discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-

001(1)

IN, OUT, GND, ERROR ±2500

SHUTDOWN ±2000

SENSE ±1500

VTAP, FEEDBACK ±1000

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The junction-to-ambient thermal resistances are as follows: 157.4°C/W for the TO-92 (LP) package, 51.3°C/W for the TO-252 (NDP)

package, 56.3°C/W for the molded PDIP (P), 117.7°C/W for the molded plastic SOIC (D), 171°C/W for the molded plastic VSSOP

(DGK). The above thermal resistances for the P, D, and DGK packages apply when the package is soldered directly to the PCB. The

value of RθJA for the WSON (NGT) package is typically 43.3°C/W but is dependent on the PCB trace area, trace material, and the

number of layers and thermal vias. For details of thermal resistance and power dissipation for the WSON package, see AN-1187

Leadless Leadframe Package (LLP).

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

Maximum input supply voltage 30 V

Junction temperature, TJ(2) LP2950AC-XX, LP2950C-XX –40 125 °C

LP2951 –55 150 °C

LP2951AC-XX, LP2951C-XX –40 125 °C

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(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2) Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by JESD51-7 - High Effective Thermal

Conductivity Test Board for Leaded Surface Mount Packages.

(3) The PCB for the TO-252 (NDP) package RθJA includes twelve (12) thermal vias under the tab per EIA/JEDEC JESD51-5.

7.4 Thermal Information: LP2950-N

THERMAL METRIC(1) LP2950-N

UNITLP (TO-92) NDP (TO-252)

3 PINS 3 PINS

RθJA(2) Junction-to-ambient thermal resistance, High-K 157.4 51.3(3) °C/W

RθJC(top) Junction-to-case (top) thermal resistance 81.2 53.5 °C/W

RθJB Junction-to-board thermal resistance 153.6 30.4 °C/W

ψJT Junction-to-top characterization parameter 25.2 5.5 °C/W

ψJB Junction-to-board characterization parameter n/a 30 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 2.2 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2) Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by JESD51-7 - High Effective Thermal

Conductivity Test Board for Leaded Surface Mount Packages.

(3) The PCB for the WSON (NGT) package RθJA includes six (6) thermal vias under the exposed thermal pad per EIA/JEDEC JESD51-5.

7.5 Thermal Information: LP2951-N

THERMAL METRIC(1)

LP2951-N

UNIT

P (PDIP) D (SOIC) DGK

(VSSOP) NGT

(WSON)

8 PINS 8 PINS 8 PINS 8 PINS

RθJA(2) Junction-to-ambient thermal resistance, High K 56.3 117.7 171.0 43.3(3) °C/W

RθJC(top) Junction-to-case (top) thermal resistance 45.7 63.7 62.3 35.0 °C/W

RθJB Junction-to-board thermal resistance 33.5 57.9 91.4 23.3 °C/W

ψJT Junction-to-top characterization parameter 22.9 15.9 8.9 0.5 °C/W

ψJB Junction-to-board characterization parameter 33.3 57.5 90.1 20.5 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a 9.1 °C/W

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(1) Unless otherwise noted, all limits apply for TA= TJ= 25°C as well as specified for VIN = (VONOM + 1 V), IL= 100 µA and CL= 1 µF for

5-V versions and 2.2 µF for 3-V and 3.3-V versions. Additional conditions for the 8-pin versions are FEEDBACK tied to VTAP, OUTPUT

tied to SENSE, and VSHUTDOWN ≤0.8 V.

(2) A Military RETS specification is available on request.

(3) All LP2950 devices have the nominal output voltage coded as the last two digits of the part number. In the LP2951 products, the 3-V

and 3.3-V versions are designated by the last two digits, but the 5-V version is denoted with no code at this location of the part number

(refer to the Package Option Addendum at end of data sheet).

(4) Ensured and 100% production tested.

(5) Ensured but not 100% production tested. These limits are not used to calculate outgoing AQL levels.

(6) Output or reference voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.

(7) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to

heating effects are covered under the specification for thermal regulation.

(8) Line regulation for the LP2951-N is tested at 150°C for IL= 1 mA. For IL= 100 µA and TJ= 125°C, line regulation is specified by design

to 0.2%. See Typical Characteristics for line regulation versus temperature and load current.

7.6 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1)

PARAMETER TEST CONDITIONS(1) LP2951(2) LP2950AC-XX

LP2951AC-XX LP2950C-XX

LP2951C-XX UNIT

MIN TYP MAX MIN TYP MAX MIN TYP MAX

3-V VERSIONS(3)

Output voltage

TJ= 25°C 2.985 3 3.015 2.985 3 3.015 2.970 3 3.030 V(4)

−25°C ≤TJ≤85°C 2.970 3 3.030 2.955 3 3.045 V(5)

Full operating

temperature range 2.964 3 3.036 V(4)

2.964 3 3.036 2.940 3 3.060 V(5)

Output voltage 100 µA ≤IL≤100 mA,

100 µA ≤IL≤100 mA,

TJ≤TJMAX

2.955 3 3.045 V(4)

2.958 3 3.042 2.928 3 3.072 V(5)

3.3-V VERSIONS(3)

Output voltage

TJ= 25°C 3.284 3.3 3.317 3.284 3.3 3.317 3.267 3.3 3.333 V(4)

−25°C ≤TJ≤85°C 3.3 3.267 3.3 3.333 3.251 3.3 3.350 V(5)

Full operating

temperature range 3.260 3.3 3.340 V(4)

3.260 3.3 3.340 3.234 3.3 3.366 V(5)

Output voltage 100 µA ≤IL≤100 mA, TJ

≤TJMAX

3.251 3.3 3.350 V(4)

3.254 3.3 3.346 3.221 3.3 3.379 V(5)

5-V VERSIONS(3)

Output voltage

TJ= 25°C 4.975 5 5.025 4.975 5 5.025 4.95 5 5.05 V(4)

−25°C ≤TJ≤85°C 5 4.95 5 5.05 4.925 5 5.075 V(5)

Full operating

temperature range 4.94 5 5.06 V(4)

4.94 5 5.06 4.9 5 5.1 V(5)

Output voltage 100 µA ≤IL≤100 mA, TJ

≤TJMAX

4.925 5 5.075 V(4)

4.925 5 5.075 4.88 5 5.12 V(5)

ALL VOLTAGE OPTIONS

Output voltage

temperature

coefficient See(6), –40°C ≤TJ≤

125°C 20 120 ppm/°C(4)

20 100 50 150 ppm/°C(5)

Line regulation(7)

(VONOM + 1 V) ≤Vin ≤30

V(8) 0.03% 0.1% 0.03% 0.11% 0.04% 0.2% See(4)

(VONOM + 1 V) ≤Vin ≤30

V(8), –40°C ≤TJ≤125°C 0.03% 0.5% See(4)

0.03% 0.2% 0.04% 0.4% (5)

Load regulation(7) 100 µA ≤IL≤100 mA 0.04% 0.1% 0.04% 0.1% 0.1% 0.2% See(4)

100 µA ≤IL≤100 mA,

–40°C ≤TJ≤125°C 0.04% 0.3% See(4)

0.04% 0.2% 0.1% 0.3% See(5)

LP2950-N

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Electrical Characteristics (continued)

over operating free-air temperature range (unless otherwise noted)(1)

PARAMETER TEST CONDITIONS(1) LP2951(2) LP2950AC-XX

LP2951AC-XX LP2950C-XX

LP2951C-XX UNIT

MIN TYP MAX MIN TYP MAX MIN TYP MAX

(9) Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value measured

at 1-V differential. At very low values of programmed output voltage, the minimum input supply voltage of 2 V (2.3 V over temperature)

must be taken into account.

(10) Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load

or line regulation effects. Specifications are for a 50 mA load pulse at VIN = 30 V (1.25-W pulse) for T = 10 ms.

(11) VREF ≤VOUT ≤(VIN −1 V), 2.3 V ≤VIN ≤30 V, 100 µA ≤IL≤100 mA, TJ≤TJMAX.

Dropout voltage(9)

IL= 100 µA 50 80 50 80 50 80 mV(4)

IL= 100 µA, –40°C ≤TJ≤

125°C 150 mV(4)

150 150 mV(5)

IL= 100 mA 380 450 380 450 380 450 mV(4)

IL= 100 mA, –40°C ≤TJ≤

125°C 600 600 600 mV(4)

600 600 mV(5)

Ground current

IL= 100 µA 75 120 75 120 75 120 µA(4)

IL= 100 µA, –40°C ≤TJ≤

125°C 140 µA(4)

140 140 µA(5)

IL= 100 mA 8 12 8 12 8 12 mA(4)

IL= 100 mA, –40°C ≤TJ≤

125°C 14 mA(4)

14 14 mA(5)

Dropout ground

current

VIN = (VONOM −0.5)V, IL

= 100 µA 110 170 110 170 110 170 µA(4)

VIN = (VONOM −0.5 V), IL

= 100 µA, –40°C ≤TJ≤

125°C

200 200 200 µA(4)

200 200 µA(5)

Current limit VOUT = 0 V 160 200 160 200 160 200 mA(4)

VOUT = 0 V, –40°C ≤TJ≤

125°C 220 mA(4)

220 220 mA(5)

Thermal regulation See(10) 0.05 0.2 0.05 0.2 0.05 0.2 %/W(4)

Output noise

10 Hz to 100 kHz

CL= 1µF (5 V Only) 430 430 430 µVRMS

CL= 200 µF 160 160 160 µVRMS

CL= 3.3 µF

(Bypass = 0.01 µF

Pins 7 to 1 (LP2951-N) 100 100 100 µVRMS

8-PIN VERSIONS ONLY LP2951 LP2951AC-XX LP2951C-XX

Reference voltage 1.22 1.235 1.25 1.22 1.235 1.25 1.21 1.235 1.26 V(4)

–40°C ≤TJ≤125°C 1.2 1.26 V(4)

1.2 1.26 1 1.2 1.27 V(5)

Reference voltage See(11), –40°C ≤TJ≤

125°C 1.19 1.27 V(4)

1.19 1.27 1.185 1.285 V(5)

Feedback pin bias

current

20 40 20 40 20 40 nA(4)

–40°C ≤TJ≤125°C 60 nA (4)

60 60 nA(5)

Reference voltage

temperature

coefficient See(6) 20 20 50 ppm/°C

Feedback pin bias

current

temperature

coefficient 0.1 0.1 0.1 nA/°C

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Electrical Characteristics (continued)

over operating free-air temperature range (unless otherwise noted)(1)

PARAMETER TEST CONDITIONS(1) LP2951(2) LP2950AC-XX

LP2951AC-XX LP2950C-XX

LP2951C-XX UNIT

MIN TYP MAX MIN TYP MAX MIN TYP MAX

(12) Comparator thresholds are expressed in terms of a voltage differential at the FEEDBACK pin below the nominal reference voltage

measured at VIN = (VO(NOM) + 1) V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain =

VOUT/VREF = (R1 + R2) / R2.For example, at a programmed output voltage of 5 V, the ERROR output is specified to go low when the

output drops by 95 mV × 5 V / 1.235 V = 384 mV. Thresholds remain constant as a percent of VOUT as VOUT is varied, with the dropout

warning occurring at typically 5% below nominal, 7.5% ensured.

(13) VSHUTDOWN ≥2 V, VIN ≤30 V, VOUT = 0, FEEDBACK pin tied to VTAP.

ERROR COMPARATOR

Output leakage

current

VOH = 30 V 0.01 1 0.01 1 0.01 1 µA(4)

VOH = 30 V, –40°C ≤TJ≤

125°C 2 µA(4)

2 2 µA(5)

Output low voltage

VIN = (VONOM −0.5 V),

IOL = 400 µA 150 250 150 250 150 250 mV(4)

VIN = (VONOM −0.5 V),

IOL = 400 µA,

–40°C ≤TJ≤125°C

400 400 400 mV(4)

400 400 mV(5)

Upper threshold

voltage

See(12) 40 60 40 60 40 60 mV(4)

See(12), –40°C ≤TJ≤

125°C 25 mV(4)

25 25 mV(5)

Lower threshold

voltage

See(12) 75 95 75 95 75 95 mV(4)

See(12), –40°C ≤TJ≤

125°C 140 mV(4)

140 140 mV(5)

Hysteresis See(12) 15 15 15 mV

SHUTDOWN INPUT

Input 1.3 1.3 1.3 V

Logic voltage Low (Regulator ON),

–40°C ≤TJ≤125°C 0.6 V(4)

0.7 0.7 V(5)

Logic voltage High (Regulator OFF),

–40°C ≤TJ≤125°C 2 V(4)

2 2 V(5)

Shutdown pin input

current

Vshutdown = 2.4 V 30 50 30 50 30 50 µA(4)

Vshutdown = 2.4 V

–40°C ≤TJ≤125°C 100 µA(4)

100 100 µA(5)

Vshutdown = 30 V 450 600 450 600 450 600 µA(4)

Vshutdown = 30 V,

–40°C ≤TJ≤125°C 750 µA(4)

750 750 µA(5)

Regulator output

current in

shutdown

See(13) 3 10 3 10 3 10 µA(4)

–40°C ≤TJ≤125°C 20 µA(4)

20 20 µA(5)

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7.7 Typical Characteristics

Figure 1. Quiescent Current Figure 2. Dropout Characteristics

Figure 3. Input Current Figure 4. Input Current

Figure 5. Output Voltage vs. Temperature of 3

Representative Units Figure 6. Quiescent Current

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Typical Characteristics (continued)

Figure 7. Quiescent Current Figure 8. Quiescent Current

Figure 9. Quiescent Current Figure 10. Short Circuit Current

Figure 11. Dropout Voltage Figure 12. Dropout Voltage

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Typical Characteristics (continued)

Figure 13. LP2951-N Minimum Operating Voltage Figure 14. LP2951-N Feedback Bias Current

Figure 15. LP2951-N Feedback Pin Current Figure 16. LP2951-N Error Comparator Output

Figure 17. LP2951-N Comparator Sink Current Figure 18. LP2951-N Enable Transient

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Typical Characteristics (continued)

Figure 19. Output Impedance Figure 20. Ripple Rejection

Figure 21. Ripple Rejection Figure 22. Ripple Rejection

Figure 23. LP2951-N Output Noise Figure 24. LP2951-N Divider Resistance

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Typical Characteristics (continued)

Figure 25. Shutdown Threshold Voltage Figure 26. Line Regulation

Figure 27. LP2951-N Maximum Rated Output Current Figure 28. LP2950-N Maximum Rated Output Current

Figure 29. Thermal Response Figure 30. Output Capacitor ESR Range

0 5 10 15 20 25 30

100

120

INPUT PIN CURRENT, IIN(A)

INPUT PIN VOLTAGE, VIN(V)

VSD= 2.0V

Output Load = Open

Ta= -50°C

Ta= -40°C

Ta= +25°C

Ta= +125°C

0 5 10 15 20 25 30

100

120

INPUT PIN CURRENT, IIN(A)

INPUT PIN VOLTAGE, VIN(V)

VSD= 2.0V

Output Load = Short to Ground

Ta= -50°C

Ta= -40°C

Ta= +25°C

Ta= +125°C

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Typical Characteristics (continued)

Figure 31. LP2951-N Input Pin Current vs Input Voltage Figure 32. LP2951-N Input Pin Current vs Input Voltage

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8 Detailed Description

8.1 Overview

The LP2950-N and LP2951-N are very high accuracy micro power voltage regulators with low quiescent current

(75 µA typical) and low dropout voltage (typical 40 mV at light loads and 380 mV at 100 mA). They are ideally

suited for use in battery-powered systems.

The LP2950-N and LP2951-N block diagram contains several features, including:

• Very high accuracy 1.23-V reference;

• Fixed 5-V, 3-V, and 3.3-V versions; and

• Internal protection circuitry, such as foldback current limit, and thermal shutdown.

The LP2951-N VERSIONS ONLY:

• Fixed 5-V, 3-V, and 3.3-V versions and programmable output version from 1.24 V to 29 V with an external

pair of resistors;

• Shutdown input, allowing turn off the regulator when the SHUTDOWN pin is pulled low; and

• Error flag output, which may be used for a power-on reset.

8.2 Functional Block Diagrams

Figure 33. LP2950-N Functional Block Diagram

Figure 34. LP2951-N Functional Block Diagram

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8.3 Feature Description

8.3.1 Fixed Voltage Options and Programmable Voltage Version

The LP2950-N and LP2951-N provide 3 fixed output options: 3 V, 3.3 V, and 5 V. Please consult factory for

custom voltages. In order to meet different application requirements, LP2951-N can also be used as a

programmable voltage regulator, with an external resistors network; please refer to Application and

Implementation for more details.

8.3.2 High Accuracy Output Voltage

With special carful design to minimize all contributions to the output voltage error, the LP2950-N/LP2951-N

distinguished itself as a very high output voltage accuracy micro power LDO. This includes a tight initial tolerance

(0.5% typical), extremely good load and line regulation (.05% typical) and a very low output voltage temperature

coefficient, making the part an ideal a low-power voltage reference.

8.3.3 Low Dropout Voltage

Generally speaking, the dropout voltage often refers to the voltage difference between the input and output

voltage (VDO = VIN – VOUT), where the main current pass-FET is fully on in the ohmic region of operation and is

characterized by the classic RDS(ON) of the FET. VDO indirectly specifies a minimum input voltage above the

nominal programmed output voltage at which the output voltage is expected to remain within its accuracy

boundary.

8.3.4 Shutdown Mode

When the SHUTDOWN pin is pulled to high level, LP2951-N enters shutdown mode and a very low quiescent

current is consumed. This function is designed for the application which needs a shutdown mode to effectively

enhance battery life cycle.

8.3.5 Error Detection Comparator Output

The LP2951-N generates a logic low output whenever its output falls out of regulation by more than

approximately 5%. Please refer to Application and Implementation for more details.

8.3.6 Internal Protection Circuitry

8.3.6.1 Short-Circuit Protection (Current Limit)

The internal current limit circuit is used to protect the LDO against high-load current faults or shorting events. The

LDO is not designed to operate in a steady-state current limit. During a current-limit event, the LDO sources

constant current. Therefore, the output voltage falls when load impedance decreases. Note also that if a current

limit occurs and the resulting output voltage is low, excessive power may be dissipated across the LDO, resulting

in a thermal shutdown of the output. A fold back feature limits the short-circuit current to protect the regulator

from damage under all load conditions. If OUT is forced below 0 V before EN goes high and the load current

required exceeds the fold back current limit, the device may not start up correctly.

8.3.6.2 Thermal Protection

The device contains a thermal shutdown protection circuit to turn off the output current when excessive heat is

dissipated in the LDO. The thermal time-constant of the semiconductor die is fairly short, and thus the output

cycles on and off at a high rate when thermal shutdown is reached until the power dissipation is reduced. The

internal protection circuitry of the device is designed to protect against thermal overload conditions. The circuitry

is not intended to replace proper heat sinking. Continuously running the device into thermal shutdown degrades

its reliability.

8.3.7 Enhanced Stability

The LP2950-N and LP2951-N is designed specifically to work with ceramic output capacitors, utilizing circuitry

which allows the regulator to be stable across the entire range of output current with an output capacitor whose

ESR is as low as 6 mΩ. For output capacitor requirement, please refer to Application and Implementation.

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8.4 Device Functional Modes

8.4.1 Operation with 30 V ≥VIN > VOUT(TARGET)+1V

The device operate if the input voltage is equal to, or exceeds VOUT(TARGET) + 1 V. At input voltages below the

minimum VIN requirement, the devices do not operate correctly and output voltage may not reach target value.

8.4.2 Operation with Shutdown Control

If the voltage on the SHUTDOWN pin is higher than 1.3 V, the device is disabled. Decreasing shutdown below

0.7 V initiates the start-up sequence of the device.

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The LP2950-N and LP2951-N are linear voltage regulator operating from 2.3 V to 30 V on the input and

regulates voltages between 1.24 V to 29 V with 0.5% accuracy and 160 mA maximum outputs current. Efficiency

is defined by the ratio of output voltage to input voltage because the LP2950-N and LP2951-N is a linear voltage

regulator. To achieve high efficiency, the dropout voltage (VIN – VOUT) must be as small as possible, thus

requiring a very low dropout LDO. Successfully implementing an LDO in an application depends on the

application requirements. If the requirements are simply input voltage and output voltage, compliance

specifications (such as internal power dissipation or stability) must be verified to ensure a solid design. If timing,

start-up, noise, PSRR, or any other transient specification is required, the design becomes more challenging.

Figure 35. Schematic Diagram

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9.2 Typical Applications

9.2.1 1-A Regulator with 1.2-V Dropout

Figure 36. 1-A Regulator with 1.2-V Dropout

9.2.1.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters.

Table 1. Design Parameters

DESIGN PARAMETER DESIGN REQUIREMENT

Input voltage 6.5 V, ±10%, provided by the DC-DC converter switching at 1 MHz

Output voltage 5 V, ±1%

Output current 100 mA (maximum), 1 mA (minimum)

RMS noise, 10 Hz to 100 kHz < 200 µVRMS

PSRR at 1 KHz > 50 dB

9.2.1.2 Detailed Design Procedure

At 100-mA loading, the dropout of the LP2950-N/LP2951-N has 600 mV maximum dropout over temperature,

thus an 1500-mV headroom is sufficient for operation over both input and output voltage accuracy. The efficiency

of the LP2950-N/LP2951-N in this configuration is VOUT / VIN = 76.9%. To achieve the smallest form factor, the

TO-92 package is selected. Input and output capacitors are selected in accordance with the Capacitor

Recommendation section. Ceramic capacitances of 1 µF for the input and one 2.2-µF capacitors for the output

are selected. With an efficiency of 73.3% and a 100-mA maximum load, the internal power dissipation is 150

mW, which corresponds to a 18.9°C junction temperature rise for the TO-92 package. With an 85°C maximum

ambient temperature, the junction temperature is at 103.9°C. To minimize noise, a bypass capacitance (CBYPASS)

of 0.01-µF is selected between pin 7 to pin 1 for LP2951-N.

9.2.1.2.1 Output Capacitor Requirements

A 1-µF (or greater) capacitor is required between the output and ground for stability at output voltages of 5 V or

higher. At lower output voltages, more capacitance is required (2.2 µF or more is recommended for 3-V and

3.3-V versions). Without this capacitor the device oscillates. Most types of tantalum or aluminum electrolytic work

fine here; even film types work but are not recommended for reasons of cost. Many aluminum electrolytics have

electrolytes that freeze at about −30°C, so solid tantalums are recommended for operation below −25°C. The

important parameters of the capacitor are an ESR of about 5 Ωor less and a resonant frequency above 500 kHz.

The value of this capacitor may be increased without limit.

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Figure 37. Output Capacitor ESR Range

The reason for the lower ESR limit is that the loop compensation of the feedback loop relies on the capacitance

value and the ESR value of the output capacitor to provide the zero that gives added phase lead (See

Figure 37).

fZ= (1 / (2 × π× COUT × ESR)) (1)

Using the 2.2 µF value from the Output Capacitor ESR Range curve (Figure 37), a useful range for fZcan be

estimated:

fZ(MIN)= (1 / (2 x π× 2.2 µF x 5 Ω)) = 14.5 kHz (2)

fZ(MAX)= (1 / (2 x π× 2.2 µF x 0.05 Ω)) = 318 kHz (3)

For ceramic capacitors, the low ESR produces a zero at a frequency that is too high to be useful, so meaningful

phase lead does not occur. A ceramic output capacitor can be used if a series resistance is added

(recommended value of resistance about 0.1 Ωto 2 Ω) to simulate the needed ESR. Only X5R, X7R, or better,

MLCC types should be used, and should have a DC voltage rating at least twice the VOUT(NOM) value.

At lower values of output current, less output capacitance is required for stability. The capacitor can be reduced

to 0.33 µF for currents below 10 mA or 0.1 µF for currents below 1 mA. Using the adjustable versions at voltages

below 5 V runs the error amplifier at lower gains so that more output capacitance is needed. For the worst-case

situation of a 100-mA load at 1.23 V output (output shorted to Feedback) a 3.3-µF (or greater) capacitor should

be used.

Unlike many other regulators, the LP2950-N remains stable and in regulation with no load in addition to the

internal voltage divider. This is especially important in CMOS RAM keep-alive applications. When setting the

output voltage of the LP2951-N versions with external resistors, a minimum load of 1 µA is recommended.

Applications having conditions that may drive the LP2950-N/51 into nonlinear operation require special

consideration. Nonlinear operation occurs when the output voltage is held low enough to force the output stage

into output current limiting while trying to pull the output voltage up to the regulated value. The internal loop

response time controls how long it takes for the device to regain linear operation when the output has returned to

the normal operating range. There are three significant nonlinear conditions that need to be considered, all can

force the output stage into output current limiting mode, all can cause the output voltage to over-shoot with low

value output capacitors when the condition is removed, and the recommended generic solution is to set the

output capacitor to a value not less than 10 µF. Although the 10 µF value for COUT may not eliminate the output

voltage over-shoot in all cases, it should lower it to acceptable levels (< 10% of VOUT(NOM)) in the majority of

cases. In all three of these conditions, applications with lighter load currents are more susceptible to output

voltage over-shoot than applications with higher load currents.

1. At power-up, with the input voltage rising faster than output stage can charge the output capacitor.

VIN tRISE(MIN) > ((COUT / 100 mA) × ΔVIN)

where

•ΔVIN = VOUT(NOM) + 1 V (4)

2. Recovery from an output short circuit to ground condition.

COUT(MIN) ≈(160 mA – ILOAD(NOM))/((VOUT(NOM)/10)/25 µs)) (5)

3. Toggling the LP2951-N SHUTDOWN pin from high (OFF) to low (ON).

COUT(MIN) ≈(160 mA – ILOAD(NOM))/((VOUT(NOM)/10)/25 µs)) (6)

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Figure 38. LP2951-N Enable Transient

9.2.1.2.2 Input Capacitor Requirements

A minimum 1 µF tantalum, ceramic or aluminum electrolytic capacitor should be placed from the LP2950-

N/LP2951-N input pin to ground if there is more than 10 inches of wire between the input and the AC filter

capacitor or if a battery is used as the input.

9.2.1.2.3 Error Detection Comparator Output

The comparator produces a logic low output whenever the LP2951-N output falls out of regulation by more than

approximately 5%. This figure is the comparator's built-in offset of about 60 mV divided by the 1.235 reference

voltage. (Refer to the block diagram in the front of the datasheet.) This trip level remains “5% below normal”

regardless of the programmed output voltage of the 2951. For example, the error flag trip level is typically 4.75 V

for a 5-V output or 11.4 V for a 12-V output. The out of regulation condition may be due either to low input

voltage, current limiting, or thermal limiting.

Figure 39 below gives a timing diagram depicting the ERROR signal and the regulated output voltage as the

LP2951-N input is ramped up and down. For 5 V versions, the ERROR signal becomes valid (low) at about 1.3-V

input. It goes high at about 5-V input (the input voltage at which VOUT = 4.75 V). Because the LP2951-N dropout

voltage is load-dependent (see curve in typical performance characteristics), the input voltage trip point (about

5 V) varies with the load current. The output voltage trip point (approx. 4.75 V) does not vary with load.

The error comparator has an open-collector output which requires an external pull up resistor. This resistor may

be returned to the output or some other supply voltage depending on system requirements. In determining a

value for this resistor, note that while the output is rated to sink 400 µA, this sink current adds to battery drain in

a low battery condition. Suggested values range from 100 k to 1 MΩ. The resistor is not required if this output is

unused.

*When VIN ≤1.3 V, the error flag pin becomes a high impedance, and the error flag voltage rises to its pullup voltage.

Using VOUT as the pullup voltage (see Figure 40), rather than an external 5-V source, keeps the error flag voltage

under 1.2 V (typical) in this condition. The user may wish to divide down the error flag voltage using equal-value

resistors (10 kΩsuggested), to ensure a low-level logic signal during any fault condition, while still allowing a valid

high logic level during normal operation.

Figure 39. ERROR Output Timing

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9.2.1.2.4 Programming the Output Voltage (LP2951-N)

The LP2951-N may be pin-strapped for the nominal fixed output voltage using its internal voltage divider by tying

the output and sense pins together, and also tying the FEEDBACK and VTAP pins together. Alternatively, it may

be programmed for any output voltage between its 1.235-V reference and its 30-V maximum rating. As seen in

Figure 40, an external pair of resistors is required.

The complete equation for the output voltage is

where

• VREF is the nominal 1.235-V reference voltage and IFB is the FEEDBACK pin bias current, nominally –20 nA (7)

The minimum recommended load current of 1 µA forces an upper limit of 1.2 MΩon the value of R2, if the

regulator must work with no load (a condition often found in CMOS in standby). IFB produces a 2% typical error in

VOUT which may be eliminated at room temperature by trimming R1. For better accuracy, choosing R2= 100 kΩ

reduces this error to 0.17% while increasing the resistor program current to 12 µA. Because the LP2951-N

typically draws 60 µA at no load with pin 2 open-circuited, this is a small price to pay.

*Drive with TTL-high to shut down. Ground or leave open if shutdown feature is not to be used.

Note: Pins 2 and 6 are left open.

Figure 40. Adjustable Regulator

Stray capacitance to the LP2951-N FEEDBACK pin can cause instability. This may especially be a problem

when using high value external resistors to set the output voltage. Adding a 100-pF capacitor between the OUT

pin and the FEEDBACK pin, and increasing the output capacitor to at least 3.3 µF, fixes this problem.

9.2.1.2.5 Reducing Output Noise

In reference applications it may be advantageous to reduce the AC noise present at the output. One method is to

reduce the regulator bandwidth by increasing the size of the output capacitor. This is the only way noise can be

reduced on the 3-lead LP2950-N but is relatively inefficient, as increasing the capacitor from 1 µF to 220 µF only

decreases the noise from 430 µVRMS to 160 µVRMS for a 100-kHz bandwidth at 5-V output.

Noise can be reduced fourfold by a bypass capacitor across R1, because it reduces the high frequency gain from

4 to unity. Pick

(8)

or about 0.01 µF. When doing this, the output capacitor must be increased to 3.3 µF to maintain stability. These

changes reduce the output noise from 430 µV to 100 µV rms for a 100-kHz bandwidth at 5-V output. With the

bypass capacitor added, noise no longer scales with output voltage so that improvements are more dramatic at

higher output voltages.

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9.2.1.3 Application Curves

Figure 41. Line Transient Response Figure 42. Load Transient Response

Figure 43. Load Transient Response

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9.2.2 300-mA Regulator with 0.75-V Dropout

In Figure 44, by paralleling the LP2951 together with 2x2N5432 (150-mA N channel JFET), a user can get a

higher output current capability around 300 mA.

Figure 44. 300-mA Regulator with 0.75-V Dropout

9.2.3 Wide Input Voltage Range Current Limiter

The LP2951 can be used as a 160-mA current limiter as Figure 45. When FB is connected to ground, the pass

element is fully turned on and out voltage will be close to input voltage. Input-output voltage ranges from 40 mV

to 400 mV, depending on load current.

*Minimum input-output voltage ranges from 40 mV to 400 mV, depending on load current. Current limit is typically

160 mA.

Figure 45. Wide Input Voltage Range Current Limiter

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9.2.4 Low Drift Current Source

The LP2951 can be used as a low drift current source as Figure 46 shows. By connected Vout to FB, Vout will

regulated at 1.235 V, and current consumption at R is IL= 1.23/R.

Figure 46. Low Drift Current Source

9.2.5 5-V Current Limiter

The LP2950 internal current limit function can be leveraged to build 5-V current limiter as Figure 47 shows. The

minimum input-output voltage ranges from 40 mV to 400 mV, depending on load current. Current limit is typically

160 mA.

*Minimum input-output voltage ranges from 40 mV to 400 mV, depending on load current. Current limit is typically

160 mA.

Figure 47. 5-V Current Limiter

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9.2.6 Regulator with Early Warning and Auxiliary Output

The LP2951 can be used to build a Regulator with early warning and auxiliary output as Figure 48 shows. it has

below features:

• Early warning flag on low input voltage

• Main output latches off at lower input voltages

• Battery backup on auxiliary output

• Operation: VOUT of regulator 1 is programmed one diode drop above 5 V. Its error flag becomes active when

VIN ≤5.7 V. When VIN drops below 5.3 V, the error flag of regulator 2 becomes active and via Q1 latches the

main output off. When VIN again exceeds 5.7 V regulator 1 is back in regulation and the early warning signal

rises, unlatching regulator 2 via D3.

Figure 48. Regulator With Early Warning and Auxiliary Output

9.2.7 Latch Off When Error Flag Occurs

As Figure 49 presents, a latch off when error flag occurs circuit works in below two mode:

When output is within ±95% of VOUT option, the error flag pin keep output high, which turns off PNP bipolar and

pulls SD pin to low, then the LP2951 keeps output regulated voltage.

When output drop to less than 95% of VOUT option, it triggers error flag output a low voltage, which turns on PNP

bipolar and pulls SD pin to high, then the device enters shutdown mode and turns off output voltage. During a

shutdown sequence, the ERROR pin continues output low, and the LP2951 device latches in shutdown mode.

Figure 49. Latch Off When Error Flag Occurs

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9.2.8 2-A Low Dropout Regulator

As Figure 50 shows, the 2-A low dropout regulator has below features:

For 5 VOUT, use internal resistors. Wire pin 6 to pin 7 and wire pin 2 to + VOUT bus.

Figure 50. 2-A Low Dropout Regulator

9.2.9 5-V Regulator with 2.5-V Sleep Function

In Figure 51, the 5-V regulator with 2.5-V sleep function works in below mode:

When sleep input is low, C-MOS output a high voltage and 2N3906 is off, then Vout = (1 + 300 KΩ/100 KΩ)×VFB

≈5 V

when sleep input is high, C-MOS output a low voltage, turns on 2N3906, then 200-KΩresistor is bypassed from

circuit, and VOUT = (1+100 KΩ/100 KΩ)×VFB ≈2.5 V.

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*High input lowers Vout to 2.5 V.

Figure 51. 5-V Regulator with 2.5-V Sleep Function

9.2.10 Open Circuit Detector for 4 →20-mA Current Loop

Figure 52 shows the open circuit detector for 4 →20-mA current loop. The circuit outputs a high level while input

current is less than 3.5 mA.

Figure 52. Open Circuit Detector for 4 →20-mA Current Loop

9.2.11 Regulator with State-of-Charge Indicator

In Figure 53, the LP339, a quad comparator, is used to indicate battery voltage state. The comparator’s negative

input voltage is equal to the LP2951 1.235-V feedback voltage. By adjusting R3, we can adjust positive input

voltage of C1~C3 to target value.

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*Optional latch off when drop out occurs. Adjust R3 for C2 Switching when Vin is 6 V.

**Outputs go low when VIN drops below designated thresholds.

Figure 53. Regulator with State-of-Charge Indicator

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9.2.12 Low Battery Disconnect

In Figure 54, a band-gap voltage reference LM385 is used to generate shutdown signal, when Vin < 5.5 V, the

LP2951 turns off and turns on again when VIN > 6 V.

For values shown, regulator shuts down when Vin < 5.5 V and turns on again at 6 V. Current drain in disconnected

mode is approximately 150 µA.

*Sets disconnect voltage.

**Sets disconnect hysteresis.

Figure 54. Low Battery Disconnect

9.2.13 System Overtemperature Protection Circuit

In Figure 55, temperature sensors LM34/35's output voltage is linearly proportional to the Celsius (Centigrade)

temperature.

At room temperature, LM34/35's output voltage is lower than 1.235-V feedback voltage, the internal pass

transistor fully turns on, and the LP2951 output voltage is close to VIN.

When ambient temperature raise higher than protection target, LM34/35's output voltage is higher than 1.235-V

feedback voltage, the internal pass transistor turns off, and the LP2951 output goes off.

LM34 for 125°F shutdown

LM35 for 125°C shutdown

Figure 55. System Overtemperature Protection Circuit

Ground

VOUT

VIN

Input

Capacitor

Output

Capacitor

OUT

SENSE

SHUTDOWN

GND ERROR

VTAP

FEEDBACK

Error Pullup

Resistor VOUT

12 3

GND

OUT

VIN

Input

Capacitor VOUT

Output

Capacitor

Ground

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10 Power Supply Recommendations

The LP2950-N and LP2951-N are designed to operate from an input voltage supply range between 2.3 V and

30 V. The input voltage range provides adequate headroom in order for the device to have a regulated output.

This input supply must be well regulated. If the input supply is noisy, additional input capacitors with low ESR can

help improve the output noise performance.

11 Layout

11.1 Layout Guidelines

For best overall performance, place all circuit components on the same side of the circuit board and as near as

practical to the respective LDO pin connections. Place ground return connections to the input and output

capacitor, and to the LDO ground pin as close to each other as possible, connected by a wide, component-side,

copper surface. The use of vias and long traces to create LDO circuit connections is strongly discouraged and

negatively affects system performance. This grounding and layout scheme minimizes inductive parasitics, and

thereby reduces load-current transients, minimizes noise, and increases circuit stability.

A ground reference plane is also recommended and is either embedded in the PCB itself or located on the

bottom side of the PCB opposite the components. This reference plane serves to assure accuracy of the output

voltage, shield noise, and behaves similar to a thermal plane to spread (or sink) heat from the LDO device. In

most applications, this ground plane is necessary to meet thermal requirements.

11.2 Layout Example

Figure 56. LP2950 Board Layout Figure 57. LP2951 VSSOP Board Layout

VOUT

VIN

Input

Capacitor

Output

Capacitor

OUT

SENSE

SHUTDOWN

GND ERROR

VTAP

FEEDBACK

Error Pullup

Resistor VOUT

Ground

4 5

Exposed

Thermal Pad

6 Thermal Vias

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Layout Example (continued)

Figure 58. LP2951 WSON Board Layout

11.3 WSON Mounting

The NGT (no pullback) 8-lead WSON package requires specific mounting techniques which are detailed in AN-

1187 Leadless Leadframe Package (LLP). Referring to the PCB Design Recommendations section, note that the

pad style which should be used with the WSON package is the NSMD (non-solder mask defined) type.

Additionally, TI recommends that the PCB terminal pads to be 0.2 mm longer than the package pads to create a

solder fillet to improve reliability and inspection.

The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the

amount of additional copper area connected to the DAP.

For the LP2951-N in the NGT 8-lead WSON package, the junction-to-case thermal rating, RθJC, is 35°C/W, where

the case is the bottom of the package at the center of the DAP.

The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive

die attach adhesive. The DAP has no direct electrical (wire) connection to any of the eight pins. There is a

parasitic PN junction between the die substrate and the device ground. As such, it is strongly recommend that

the DAP be connected directly to the ground at device lead 4 (that is, GND). Alternately, but not recommended,

the DAP may be left floating (that is, no electrical connection). The DAP must not be connected to any potential

other than ground.

LP2950-N

LP2951-N

SNVS764Q –JANUARY 2000–REVISED DECEMBER 2017

www.ti.com

Product Folder Links: LP2950-N LP2951-N

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation, see the following:

AN-1187 Leadless Leadframe Package (LLP)

12.2 Related Links

Table 2 lists quick access links. Categories include technical documents, support and community resources,

tools and software, and quick access to sample or buy.

Table 2. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

LP2950-N Click here Click here Click here Click here Click here

LP2951-N Click here Click here Click here Click here Click here

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP2950ACZ-3.0/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 2950A

CZ3.0

LP2950ACZ-3.3/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 2950A

CZ3.3

LP2950ACZ-5.0/LFT1 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2950A

CZ5.0

LP2950ACZ-5.0/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2950A

CZ5.0

LP2950ACZ-5.0/LFT7 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2950A

CZ5.0

LP2950ACZ-5.0/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 2950A

CZ5.0

LP2950CDT-3.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-3.0

LP2950CDT-3.3 NRND TO-252 NDP 3 75 Non-RoHS

& Green Call TI Call TI -40 to 125 LP2950

CDT-3.3

LP2950CDT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-3.3

LP2950CDT-5.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-5.0

LP2950CDTX-3.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-3.0

LP2950CDTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-3.3

LP2950CDTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-5.0

LP2950CZ-3.0/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 2950

CZ3.0

LP2950CZ-3.3/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2950

CZ3.3

LP2950CZ-3.3/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 2950

CZ3.3

LP2950CZ-5.0/LFT1 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2950

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

CZ5.0

LP2950CZ-5.0/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2950

CZ5.0

LP2950CZ-5.0/LFT7 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2950

CZ5.0

LP2950CZ-5.0/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 2950

CZ5.0

LP2951ACM NRND SOIC D 8 95 Non-RoHS

& Green Call TI Call TI -40 to 125 2951

ACMC

LP2951ACM-3.0/NOPB ACTIVE SOIC D 8 95 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951A

CM30C

LP2951ACM-3.3 NRND SOIC D 8 95 Non-RoHS

& Green Call TI Call TI -40 to 125 2951A

CM33C

LP2951ACM-3.3/NOPB ACTIVE SOIC D 8 95 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951A

(CM33>D, CM33C)

LP2951ACM/NOPB ACTIVE SOIC D 8 95 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951

ACM>D

LP2951ACMM NRND VSSOP DGK 8 1000 Non-RoHS

& Green Call TI Call TI -40 to 125 L0DA

LP2951ACMM-3.0 NRND VSSOP DGK 8 1000 Non-RoHS

& Green Call TI Call TI -40 to 125 L0BA

LP2951ACMM-3.0/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0BA

LP2951ACMM-3.3 NRND VSSOP DGK 8 1000 Non-RoHS

& Green Call TI Call TI -40 to 125 L0CA

LP2951ACMM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0CA

LP2951ACMM/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0DA

LP2951ACMMX-3.0/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0BA

LP2951ACMMX-3.3/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0CA

LP2951ACMMX/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0DA

LP2951ACMX NRND SOIC D 8 2500 Non-RoHS

& Green Call TI Call TI -40 to 125 2951

(ACM>D, ACMC)

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP2951ACMX-3.0/NOPB ACTIVE SOIC D 8 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951A

CM30C

LP2951ACMX-3.3/NOPB ACTIVE SOIC D 8 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951A

(CM33>D, CM33C)

LP2951ACMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951

(ACM>D, ACMC)

LP2951ACN/NOPB ACTIVE PDIP P 8 40 RoHS & Green Call TI | SN Level-1-NA-UNLIM -40 to 125 LP

2951ACN

LP2951ACSD/NOPB ACTIVE WSON NGT 8 1000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2951AC

LP2951ACSDX-3.3/NOPB ACTIVE WSON NGT 8 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 51AC33

LP2951ACSDX/NOPB ACTIVE WSON NGT 8 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 2951AC

LP2951CM NRND SOIC D 8 95 Non-RoHS

& Green Call TI Call TI -40 to 125 2951

CMC

LP2951CM-3.0/NOPB ACTIVE SOIC D 8 95 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951C

M30C

LP2951CM-3.3/NOPB ACTIVE SOIC D 8 95 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951C

M33>D

LP2951CM/NOPB ACTIVE SOIC D 8 95 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951

(CM>D, CMC)

LP2951CMM NRND VSSOP DGK 8 1000 Non-RoHS

& Green Call TI Call TI -40 to 125 L0DB

LP2951CMM-3.0/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0BB

LP2951CMM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0CB

LP2951CMM/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0DB

LP2951CMMX NRND VSSOP DGK 8 3500 Non-RoHS

& Green Call TI Call TI -40 to 125 L0DB

LP2951CMMX-3.0/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0BB

LP2951CMMX-3.3/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0CB

LP2951CMMX/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0DB

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 4

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP2951CMX-3.0/NOPB ACTIVE SOIC D 8 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951C

M30C

LP2951CMX-3.3/NOPB ACTIVE SOIC D 8 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951C

(M33>D, M33C)

LP2951CMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2951

CM>D

LP2951CN/NOPB ACTIVE PDIP P 8 40 RoHS & Green Call TI | SN Level-1-NA-UNLIM -40 to 125 LP

2951CN

LP2951CSD-3.0/NOPB ACTIVE WSON NGT 8 1000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 51AC30B

LP2951CSD-3.3/NOPB ACTIVE WSON NGT 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 51AC33B

LP2951CSD/NOPB ACTIVE WSON NGT 8 1000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2951ACB

LP2951CSDX-3.3/NOPB ACTIVE WSON NGT 8 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 51AC33B

LP2951CSDX/NOPB ACTIVE WSON NGT 8 4500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2951ACB

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 5

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LP2951-N :

•Automotive: LP2951-Q1

NOTE: Qualified Version Definitions:

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LP2950CDTX-3.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LP2950CDTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LP2950CDTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LP2951ACMM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMM-3.0 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMM-3.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMM-3.3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMMX-3.0/NOP

BVSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMMX-3.3/NOP

BVSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951ACMX-3.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951ACMX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951ACSD/NOPB WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Feb-2021

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LP2951ACSDX-3.3/NOPB WSON NGT 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951ACSDX/NOPB WSON NGT 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951CMM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMM-3.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMMX VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMMX-3.0/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMMX-3.3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMX-3.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951CMX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951CMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951CSD-3.0/NOPB WSON NGT 8 1000 180.0 12.4 4.3 4.3 1.1 8.0 12.0 Q1

LP2951CSD-3.3/NOPB WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951CSD/NOPB WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951CSDX-3.3/NOPB WSON NGT 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951CSDX/NOPB WSON NGT 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

*All dimensions are nominal

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Feb-2021

Pack Materials-Page 2

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LP2950CDTX-3.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LP2950CDTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LP2950CDTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LP2951ACMM VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMM-3.0 VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMM-3.3 VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMMX-3.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951ACMMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951ACMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951ACMX SOIC D 8 2500 367.0 367.0 35.0

LP2951ACMX-3.0/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951ACMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951ACSD/NOPB WSON NGT 8 1000 210.0 185.0 35.0

LP2951ACSDX-3.3/NOPB WSON NGT 8 4500 367.0 367.0 35.0

LP2951ACSDX/NOPB WSON NGT 8 4500 367.0 367.0 35.0

LP2951CMM VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951CMM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951CMM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951CMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951CMMX VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951CMMX-3.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951CMMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951CMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951CMX-3.0/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951CMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951CMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951CSD-3.0/NOPB WSON NGT 8 1000 200.0 183.0 25.0

LP2951CSD-3.3/NOPB WSON NGT 8 1000 210.0 185.0 35.0

LP2951CSD/NOPB WSON NGT 8 1000 210.0 185.0 35.0

LP2951CSDX-3.3/NOPB WSON NGT 8 4500 367.0 367.0 35.0

LP2951CSDX/NOPB WSON NGT 8 4500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Feb-2021

Pack Materials-Page 3

www.ti.com

PACKAGE OUTLINE

8X 0.35

0.25

3 0.05

2.4

2.6 0.05

6X 0.8

0.8 MAX

0.05

0.00

8X 0.5

0.3

A4.1

3.9 B

4.1

3.9

(0.2) TYP

WSON - 0.8 mm max heightNGT0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214935/A 08/2020

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

PIN 1 ID 0.1 C A B

0.05 C

THERMAL PAD

EXPOSED

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

8X (0.3)

(3)

(3.8)

6X (0.8)

(2.6)

( 0.2) VIA

TYP (1.05)

(1.25)

8X (0.6)

(R0.05) TYP

WSON - 0.8 mm max heightNGT0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214935/A 08/2020

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

SYMM 9

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED

METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(R0.05) TYP

(1.31)

(0.675)

8X (0.3)

8X (0.6)

(1.15)

(3.8)

(0.755)

6X (0.8)

WSON - 0.8 mm max heightNGT0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214935/A 08/2020

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 9:

77% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:20X

SYMM

METAL

TYP

SYMM 9

www.ti.com

PACKAGE OUTLINE

10.42

9.40

6.73

6.35

6.22

5.97 1.27

0.88

5.46

4.96

2.285

4.57

1.02

0.64

3X 0.88

0.64

2.55 MAX

0.88

0.46

1.14

0.89

0.60

0.46

0.17

0.51 MIN

4.32 MIN

(2.345)

(2.5)

TO-252 - 2.55 mm max heightNDP0003B

TRANSISTOR OUTLINE

4219870/A 03/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Reference JEDEC registration TO-252.

0.25 C A B

TOP & BOTTOM

PKG

OPTIONAL

SEATING PLANE

SCALE 1.500

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ALL AROUND 0.07 MIN

ALL AROUND

(4.57)

2X (1.3) 2X (2.15) (5.7)

(5.5)

(2.285)(4.38)

(R0.05) TYP

TO-252 - 2.55 mm max heightNDP0003B

TRANSISTOR OUTLINE

4219870/A 03/2018

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers

SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).

5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 8X

SYMM

PKG

SEE SOLDER MASK

DETAIL

EXPOSED

METAL

METAL EDGE

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED) SOLDER MASK DETAIL

EXPOSED

METAL

METAL UNDER

SOLDER MASK

OPENING

SOLDER MASK DEFINED

www.ti.com

EXAMPLE STENCIL DESIGN

2X (2.15)

2X (1.3)

(4.57)

(4.38)

(1.32) TYP

(1.35) TYP

(0.26) (R0.05) TYP

16X (1.12)

16X (1.15)

TO-252 - 2.55 mm max heightNDP0003B

TRANSISTOR OUTLINE

4219870/A 03/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

PKG

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL

SCALE: 8X

www.ti.com

PACKAGE OUTLINE

.228-.244 TYP

[5.80-6.19]

.069 MAX

[1.75]

6X .050

[1.27]

8X .012-.020

[0.31-0.51]

.150

[3.81]

.005-.010 TYP

[0.13-0.25]

0 - 8 .004-.010

[0.11-0.25]

.010

[0.25]

.016-.050

[0.41-1.27]

4X (0 -15 )

.189-.197

[4.81-5.00]

NOTE 3

B .150-.157

[3.81-3.98]

NOTE 4

4X (0 -15 )

(.041)

[1.04]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.

Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed .006 [0.15] per side.

4. This dimension does not include interlead flash.

5. Reference JEDEC registration MS-012, variation AA.

.010 [0.25] C A B

PIN 1 ID AREA

SEATING PLANE

.004 [0.1] C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.800

www.ti.com

EXAMPLE BOARD LAYOUT

.0028 MAX

[0.07]

ALL AROUND

.0028 MIN

[0.07]

ALL AROUND

(.213)

[5.4]

6X (.050 )

[1.27]

8X (.061 )

[1.55]

8X (.024)

[0.6]

(R.002 ) TYP

[0.05]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

EXPOSED

METAL

OPENING

SOLDER MASK METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:8X

SYMM

SEE

DETAILS

SYMM

www.ti.com

EXAMPLE STENCIL DESIGN

8X (.061 )

[1.55]

8X (.024)

[0.6]

6X (.050 )

[1.27] (.213)

[5.4]

(R.002 ) TYP

[0.05]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL

SCALE:8X

SYMM

www.ti.com

PACKAGE OUTLINE

3X 2.67

2.03

5.21

4.44

5.34

4.32

12.7 MIN

2X 1.27 0.13

3X 0.55

0.38

4.19

3.17

3.43 MIN

3X 0.43

0.35

(2.54)

NOTE 3

2.6 0.2

4 MAX

SEATING

PLANE

0.076 MAX

(0.51) TYP

(1.5) TYP

TO-92 - 5.34 mm max heightLP0003A

TO-92

4215214/B 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Lead dimensions are not controlled within this area.

4. Reference JEDEC TO-226, variation AA.

5. Shipping method:

a. Straight lead option available in bulk pack only.

b. Formed lead option available in tape and reel or ammo pack.

c. Specific products can be offered in limited combinations of shipping medium and lead options.

d. Consult product folder for more information on available options.

EJECTOR PIN

OPTIONAL

PLANE

SEATING

STRAIGHT LEAD OPTION

321

SCALE 1.200

FORMED LEAD OPTION

OTHER DIMENSIONS IDENTICAL

TO STRAIGHT LEAD OPTION

SCALE 1.200

www.ti.com

EXAMPLE BOARD LAYOUT

0.05 MAX

ALL AROUND

TYP

(1.07)

(1.5) 2X (1.5)

2X (1.07)

(1.27)

(2.54)

FULL R

TYP

( 1.4)0.05 MAX

ALL AROUND

TYP

(2.6)

(5.2)

(R0.05) TYP

3X ( 0.9) HOLE

2X ( 1.4)

METAL

3X ( 0.85) HOLE

(R0.05) TYP

4215214/B 04/2017

TO-92 - 5.34 mm max heightLP0003A

TO-92

LAND PATTERN EXAMPLE

FORMED LEAD OPTION

NON-SOLDER MASK DEFINED

SCALE:15X

SOLDER MASK

OPENING

METAL

SOLDER MASK

OPENING

123

LAND PATTERN EXAMPLE

STRAIGHT LEAD OPTION

NON-SOLDER MASK DEFINED

SCALE:15X

METAL

TYP

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL

12 3

www.ti.com

TAPE SPECIFICATIONS

19.0

17.5

13.7

11.7

11.0

8.5

0.5 MIN

TYP-4.33.7

9.75

8.50

TYP

2.9

2.4 6.75

5.95

13.0

12.4

(2.5) TYP

16.5

15.5

4215214/B 04/2017

TO-92 - 5.34 mm max heightLP0003A

TO-92

FOR FORMED LEAD OPTION PACKAGE

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