LP3997
VIN
Enable
DELAY
VOUT
Error/POR
VIN
SD SENSE
VOUT
CBYP
ERROR
2.2 PF2.2 PF
470k
GND
1
7
6
5
4
8
2
3
0.1 PF0.1 PF
LP3997
www.ti.com
SNVS272B –MAY 2004–REVISED MAY 2013
Micropower 250-mA CMOS LDO Regulator With Error Flag and Power-On-Reset
Check for Samples: LP3997
1FEATURES DESCRIPTION
The LP3997 regulator is designed to meet the
2• Low 140-mV Dropout at 250-mA Load requirements of portable, battery-powered systems,
• Stable With Ceramic Capacitor. providing accurate output voltage, low noise, and low
• Low Noise With Bypass Capacitor quiescent current. The LP3997 provides 3.3V output
at up to 250mA load current. The chip architecture is
• Less Than 80 µA Typical IQat 250 mA capable of providing output voltages as low as 0.8V.
• Virtually Zero IQ(Disabled) When switched in shutdown mode, the power
• Thermal and Short Circuit Protection consumption is virtually zero.
• 3.3-V Output (1) The LP3997 is designed to be stable with space
• 8-Lead VSSOP Package (2) saving ceramic output capacitor as small as 1µF.
The LP3997 also includes an out-of-regulation error
APPLICATIONS flag. When the output is more than 5% below its
• Portable Consumer Electronics nominal voltage, the error flag sets to low. If a
capacitor is connected to device’s delay pin, a
• Cellular Handsets delayed power-on reset signal will be generated.
• Laptop and Palm Computers
• PDAs
• Digital Cameras
(1) For other voltage options, contact your TI sales office
(2) For other package options, contact your TI sales office.
Typical Application Circuit
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
8
6
5
7
1
3
4
2
VOUT
VIN
GND
DELAY
CBYP
SENSE
SD
ERROR
VREF
POR
+
-
VIN
CBYP GND DELAY
VOUT
2.2 PA
+
-
SENSE
SD
ERROR
1.2V
6 M:
RFB2
RFB1
0.5V
OFF
ON
LP3997
SNVS272B –MAY 2004–REVISED MAY 2013
www.ti.com
Functional Block Diagram
Pin Descriptions
Pin No. Name Description
1 CBYP Noise bypass pin. For low noise applications a 0.1µF or larger ceramic capacitor should be connected from
this pin to ground. This will also improve PSSR.
2 DELAY A capacitor connected from this pin to ground will allow a delayed power-on-reset signal at the ERROR (pin
7) output. See Applications Information.
3 GND Ground pin. Local ground for CBYP ,CIN, COUT and CDELAY.
4 VIN Input supply pin. Connect CIN between this pin and GND.
5 VOUT Output voltage, Connect COUT between this pin and ground.
6 SENSE Connect this pin to VOUT (pin 5). For best performance the connection should be made as close to the load
as possible.
7 ERROR This open drain output is an error flag output which goes low when VOUT drops 5% below its nominal
voltage. This pin also provides a power-on-reset signal if a capacitor is connected to the DELAY pin.
8 SD Shutdown. Disables the regulator when less than 0.4V is applied. Enables the regulator when greater than
0.9V. The Shutdown pin is pulled down internally by a 6MΩresistor.
Connection Diagram
8-Lead VSSOP
Package Number DGK
2Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
LP3997
www.ti.com
SNVS272B –MAY 2004–REVISED MAY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1) (2)(3)
Input Voltage -0.3 to 6.5V
Output Voltage -0.3 to (VIN + 0.3V) with 6.5V (max)
SD Input Voltage -0.3 to (VIN + 0.3V) with 6.5V (max)
Junction Temperature 150°C
Lead/Pad Temp.
VSSOP 260°C
Storage Temperature -65 to 150°C
Continuous Power Dissipation Internally Limited(4)
Human Body Model(5) 2KV
All Pins Except CBYP Machine Model 200V
ESD Human Body Model(5) 1KV
CBYP Pin Machine Model 100V
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) All Voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage.
(5) The human body model is 100pF discharged through a 1.5kΩresistor into each pin. The machine model is a 200pF capacitor
discharged directly into each pin.
Operating Ratings(1)
Input Voltage 2V to 6V
Junction Temperature -40°C to 125°C
Ambient Temperature TARange(2) -40°C to 85°C
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125°C), the
maximum power dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max) = TJ(max-op) - (θJA × PD(max)).
Thermal Properties(1)
Junction To Ambient Thermal Resistance(2),θJA (VSSOP) 210°C/W
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power
dissipation is possible, special care must be paid to thermal dissipation issues in board design.
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LP3997
LP3997
SNVS272B –MAY 2004–REVISED MAY 2013
www.ti.com
Electrical Characteristics
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.
Typical values and limits appearing in normal type apply for TJ= 27°C. Limits appearing in boldface type apply over the full
temperature range for operation, −40 to +125°C. (1)
Limit
Symbol Parameter Test Conditions Typ Unit
Min Max
VIN Input Voltage 2 6 V
ΔVOUT Output Voltage Tolerance Over full line and load regulation -1.5 +1.5 %
-3 +3
Line Regulation Error VIN = (VOUT(NOM) + 1.0V) to 6.0V, 0.02 0.3 %/V
IOUT = 1mA
Load Regulation Error IOUT = 1mA to 250mA 20 80 µV/mA
VDO Dropout Voltage(2) IOUT = 250mA 140 400 mV
ILOAD Load Current See (3) (4) 0 µA
IQQuiescent Current SD = 950mV, IOUT = 0mA 55 100
SD = 950mV, IOUT = 250mA 80 150 µA
SD = 0.4V 0.01 0.5
ISC Short Circuit Current Limit See (5) 600 1000 mA
IOUT Maximum Output Current 250 mA
PSRR Power Supply Rejection Ratio CBYP = 0.1µF f = 1kHz, IOUT = 61
1mA to 150mA
f = 10kHz, IOUT = 55
150mA dB
Without CBYP f = 1kHz, IOUT = 61
1mA to 150mA
f = 10kHz, IOUT = 39
150mA
w/o CBYP 180
BW = 10Hz to 100kHz,
enOutput noise Voltage(4) µVRMS
VIN = VOUT(nom) +1V CBYP = 0.1µF 100
TSHUTDOWN Thermal Shutdown Temperature 150 °C
Hysteresis 10
Shutdown Control Characteristics
ISD Maximum Input Current at SD SD = 0.0V 0.01 µA
Input SD = 6V (6) 1
VIL Low Input Threshold VIN = 2V to 6V 0.4 V
VIH High Input Threshold VIN = 2V to 6V 0.95 V
Error Flag Characteristics
VTH Power Good Trip Threshold VIN Rising 95 91 99 %VOUT
VHYST Hysteresis VIN Rising or Falling 2.5 %VOUT
VOL ErrorError OutputOutput low ISINK = 2mA 0.1 0.4 V
Voltage
IOFF Error Output High Leakage ERROR = VOUT(NOM) 10 2000 nA
IDELAY Delay Pin Current Source VOUT > 95% VOUT(NOM) 2.2 1.2 3 µA
(1) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production at TJ= 25°C or correlated
using Statistical Quality Control methods. Operation over the temperature specification is ensured by correlating the electrical
characteristics to process and temperature variations and applying statistical process control.
(2) Dropout voltage is defined as the voltage difference between input and output when the output voltage drops 100mV below its nominal
value.
(3) The device maintains the regulated output voltage without the load.
(4) This electrical specification is ensured by design.
(5) Short circuit current is measured on the input supply line at the point when the short circuit condition reduces the output voltage to 5% of
its nominal value.
(6) SD Pin has 6MΩtypical, resistor connected to GND.
4Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
LP3997
www.ti.com
SNVS272B –MAY 2004–REVISED MAY 2013
Electrical Characteristics (continued)
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.
Typical values and limits appearing in normal type apply for TJ= 27°C. Limits appearing in boldface type apply over the full
temperature range for operation, −40 to +125°C. (1)
Limit
Symbol Parameter Test Conditions Typ Unit
Min Max
Timing Characteristics
tON Turn On Time (7) To 95% Level w/o CBYP 150 250 µs
CBYP = 0.1µF 2 ms
Transient Line Transient Response Trise = Tfall = 30µs(7) w/o CBYP 40 mV
Response |δVOUT|δVIN = 600mV (pk - pk)
CBYP = 0.1µF 4
Load Transient Response Trise = Tfall = 1µs(7) 70 80 mV
|δVOUT| IOUT = 1mA to 150mA
(7) This electrical specification is ensured by design.
Output Capacitor, Recommended Specifications Limit
Symbol Parameter Conditions Typ Unit
Min Max
CoOutput Capacitor Capacitance(1) 2.2 0.7 µF
ESR 5 500 mΩ
(1) The capacitor tolerance should be 30% or better over temperature. The full operating conditions for the application should be considered
when selecting a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is
X7R. However, dependent on application, X5R, Y5V, and Z5U can also be used. (See capacitor characteristics section in Applications
Information).
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LP3997
0 50 100 150 200 250
LOAD CURRENT (mA)
DROPOUT VOLTAGE (mV)
0
20
40
60
80
100
120
140
160
180
200
TA = 125oC
TA = -40oC
TA = 25oC
3.5 4 4.5 5 5.5 6
VIN
GND I (PA)
20
30
40
50
60
70
80
90
100
110
120
TA = 85oC
TA = -40oC
TA = 25oC
3.5 4 4.5 5 5.5 6
VIN
GND I (PA)
20
30
40
50
60
70
80
90
100
110
120
TA = 85oC
TA = -40oC
TA = 25oC
3.5 4 4.5 5 5.5 6
VIN
GND I (PA)
20
30
40
50
60
70
80
90
100
110
120
TA = 85oC
TA = -40oC
TA = 25oC
0 50 100 150 200 250
LOAD CURRENT (mA)
GROUND CURRENT (PA)
0
10
20
30
40
50
60
70
80
90
100
TA = 125oC
TA = -40oC
TA = 25oC
-50 -25 0 25 50 75 100 125
TEMPERATURE (oC)
-3.00
-2.00
-1.00
0.00
1.00
2.00
3.00
VOUT CHANGE (%)
LP3997
SNVS272B –MAY 2004–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics.
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.
Typical values and limits appearing in normal type apply for TJ= 27°C. Limits appearing in boldface type apply over the full
temperature range for operation, −40 to +125°C.
Output Voltage Change vs Temperature Ground Current vs Load Current
Ground Current vs VIN. ILOAD = 0mA Ground Current vs VIN. ILOAD = 1mA
Ground Current vs VIN. ILOAD = 250mA Dropout Voltage vs Load Current
6Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
TIME (500 Ps/DIV)
CBYP = 0.1 PF
IL = 1 mA
VSD
(1V/DIV) VOUT
(1V/DIV)
LOAD CURRENT
(mA)
TIME (500 Ps/DIV)
'VOUT
(50 mV/DIV)
250
CIN = COUT = 2.2 PF
1
TIME (100 Ps/DIV)
CBYP = 0
IL = 1 mA
VSD
(1V/DIV) VOUT
(1V/DIV)
VIN (V)
TIME (100 Ps/DIV)
'VOUT
(20 mV/DIV)
4.9
CIN = COUT = 2.2 PF
CBYP = 0
IL = 1 to 250 mA
4.3
VIN (V)
TIME (100 Ps/DIV)
'VOUT
(10 mV/DIV)
4.9
CIN = COUT = 2.2 PF
CBYP = 0.1 PF
IL = 1 to 250 mA
4.3
LP3997
www.ti.com
SNVS272B –MAY 2004–REVISED MAY 2013
Typical Performance Characteristics. (continued)
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.
Typical values and limits appearing in normal type apply for TJ= 27°C. Limits appearing in boldface type apply over the full
temperature range for operation, −40 to +125°C.
Line Transient Line Transient
Load Transient (No CBYP) Enable Start-up Time
Enable Start-up Time Short Circuit Current
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LP3997
TIME (20 ms/DIV)
CDELAY = 0.1 PF
CBYP = 0
ILOAD = 250 mA
VOUT 2V/DIV
VIN 2V/DIV
CDELAY 2V/DIV
ERROR 2V/DIV
TIME (50 Ps/DIV)
CDELAY = 0.1 PF
CBYP = 0
ILOAD = 250 mA
VOUT 2V/DIV
VIN 2V/DIV
CDELAY 2V/DIV
ERROR 2V/DIV
100 1M
FREQUENCY (kHz)
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
RIPPLE REJECTION (dB)
1k 10k 100k
IOUT = 150 mA
CBYP = 0.1 PF
IOUT = 1 mA
1 10 100
FREQUENCY (kHz)
0.01
0.1
1
10
NOISE (PV/ Hz)
0.1
CBYP = 0
CBYP = 0.1 PF
LP3997
SNVS272B –MAY 2004–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics. (continued)
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.
Typical values and limits appearing in normal type apply for TJ= 27°C. Limits appearing in boldface type apply over the full
temperature range for operation, −40 to +125°C.
Power Supply Rejection Ratio Noise Spectrum
Turn-On Sequence Turn-Off Sequence
8Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
t DELAY =VTH(DELAY)
I DELAY
C DELAY
X
LP3997
www.ti.com
SNVS272B –MAY 2004–REVISED MAY 2013
Applications Information
External Capacitors
In common with most regulators, the LP3997 requires the inclusion of external capacitors.
VIN
An input capacitor is required for stability. It is recommended that a minimum of 1.0µF capacitor is connected
between the LP3997 input pin and ground (this capacitance value may be increased without limit).
This capacitor must be located a distance of not more than 1cm from the input pin and returned to a clean
analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
Important: To ensure stable operation it is essential that good PCB design practices are employed to minimize
ground impedance and keep input inductance low. If these conditions cannot be met, or if long wire leads are
used to connect the battery or other power source to the LP3997, then it is recommended to increase the input
capacitor to at least 2.2µF. Also, tantalum capacitors can suffer catastrophic failures due to surge current when
connected to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is
used at the input, it must be ensured by the manufacturer to have a surge current rating sufficient for the
application.
There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain ≊
1.0µF over the entire operating temperature range.
VOUT
VOUT is the output voltage of the regulator. Connect capacitance (minimum 1.0µF) to ground from this pin. To
ensure stability the capacitor must meet the minimum value for capacitance and have an ESR in the range 5mΩ
to 500mΩ. Ceramic X7R types are recommended. If an output capacitor larger than 4.7µF is fitted then checks
on in-rush current, transient performance and stability, should be made.
SENSE
SENSE is used to sense the output voltage. Connect sense to VOUT
SHUTDOWN
SD controls the turning on and off of the LP3997. VOUT is ensured to be on when the voltage on the SD pin is
greater than 0.95V. VOUT is ensured to be off when the voltage on the SD pin is less than 0.4V.
ERROR
ERROR is an open drain output which is set low when VOUT is more than 5% below its nominal value. An
external pull up resistor is required on this pin. When a capacitor is connected from DELAY to GROUND, the
error signal is delayed (see DELAY section). This delayed error signal can be used as the power-on reset signal
for the application system. The ERROR pin is disconnected when not used.
DELAY
A capacitor from DELAY to GROUND sets the time delay for ERROR changing from low to high state. The delay
time is set by the following formula.
VTH(DELAY) is nominally 1.2V.
The DELAY pin should be open circuit if not used.
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LP3997
0 1.0 2.0 3.0 4.0 5.0
CAP VALUE (% of Nom. 1 PF)
DC BIAS (V)
100%
80%
60%
40%
20%
0402, 6.3V, X5R
0603, 10V, X5R
LP3997
SNVS272B –MAY 2004–REVISED MAY 2013
www.ti.com
CBYP
For low noise application, connect a high frequency ceramic capacitor from CBYP to ground, A 0.01µF to 0.1µF
X5R or X7R is recommended. This capacitor is connected directly to high impedance node in the band gap
reference circuit. Any significant loading on this node will cause a change in the regulated output voltage. For this
reason, DC leakage current from this pin must be kept as low as possible for best output voltage accuracy.
CAPACITOR CHARACTERISTICS
In common with most regulators, the LP3997 requires external capacitors for regulator stability. The LP3997 is
specifically designed for portable applications requiring minimum board space and can use capacitors in the
range 1µF to 4.7µF.These capacitors must be correctly selected for good performance. Ceramic capacitors are
the smallest, least expensive and have the lowest ESR values (which makes them best for eliminating high
frequency noise). The ESR of a typical 1µF ceramic capacitor is in the range of 20 mΩto 40 mΩ, which easily
meets the ESR requirement for stability by the LP3997.These capacitors must be correctly selected to ensure
good performance of the LP3997.
For both input and output capacitors careful interpretation of the capacitor specification is required to ensure
correct device operation. The capacitor value can change greatly dependant on the conditions of operation and
capacitor type.
In particular the output capacitor selection should take account of all the capacitor parameters to ensure that the
specification is met within the application. Capacitance value can vary with DC bias conditions as well as
temperature and frequency of operation. Capacitor values will also show some decrease over time due to aging.
The capacitor parameters are also dependant on the particular case size with smaller sizes giving poorer
performance figures in general. As an example Figure 1 shows a typical graph showing a comparison of
capacitor case sizes in a Capacitance versus DC Bias plot. As shown in the graph, as a result of the DC Bias
condition, the capacitance value may drop below the minimum capacitance value given in the recommended
capacitor table (0.7µF in this case). Note that the graph shows the capacitance out of spec for the 0402 case
size capacitor at higher bias voltages. It is therefore recommended that the capacitor manufacturers’
specifications for the nominal value capacitor are consulted for all conditions as some capacitor sizes (e.g. 0402)
may not be suitable in the actual application.
Figure 1. Capacitance versus DC Bias Plot
The value of ceramic capacitors can vary with temperature. The capacitor type X7R, which operates over a
temperature range of -55°C to +125°C, will only vary the capacitance to within ±15%. The capacitor type X5R
has a similar tolerance over a reduced temperature range of -55°C to +85°C. Most large value ceramic
capacitors, larger than 1µF are manufactured with Z5U or Y5V temperature characteristics. Their capacitance
can drop by more than 50% as the temperature goes from 25°C to 85°C. Therefore X7R is recommended over
Z5U and Y5V in applications where the ambient temperature will change significantly above or below 25°C.
Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more
expensive when comparing equivalent capacitance and voltage ratings in the 1µF to 4.7µF range.
10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
LP3997
www.ti.com
SNVS272B –MAY 2004–REVISED MAY 2013
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the
stable range, it would have to be larger in capacitance (which means bigger and more costly ) than a ceramic
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about
2:1 as the temperature goes from 25°C down to -40°C, so some guard band must be allowed.
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LP3997
LP3997
SNVS272B –MAY 2004–REVISED MAY 2013
www.ti.com
REVISION HISTORY
Changes from Revision A (May 2013) to Revision B Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 11
12 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
PACKAGE OPTION ADDENDUM
www.ti.com 7-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP3997MM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SAKB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP3997MM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP3997MM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
LP3997MM-3.3 LP3997MM-3.3/NOPB