© Semiconductor Components Industries, LLC, 2011
April, 2011 Rev. 4
1Publication Order Number:
VN2222LL/D
VN2222LLG
Small Signal MOSFET
150 mAmps, 60 Volts
NChannel TO92
Features
This is a PbFree Device*
MAXIMUM RATINGS
Rating Symbol Value Unit
DrainSource Voltage VDSS 60 Vdc
DrainGate Voltage (RGS = 1.0 MW)VDGR 60 Vdc
GateSource Voltage
Continuous
Nonrepetitive (tp 50 ms)
VGS
VGSM
±20
±40
Vdc
Vpk
Drain Current
Continuous
Pulsed
ID
IDM
150
1000
mAdc
Total Power Dissipation @ TA = 25°C
Derate above 25°C
PD400
3.2
mW
mW/°C
Operating and Storage Temperature Range TJ, Tstg 55 to
+150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, JunctiontoAmbient RqJA 312.5 °C/W
Maximum Lead Temperature for
Soldering Purposes, 1/16 from case
for 10 seconds
TL300 °C
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
VN22
22LL
AYWW G
G
D
G
TO92
CASE 29
STYLE 22
NChannel
S
123
1
Source
3
Drain
2
Gate
150 mA, 60 V
RDS(on) = 7.5 W
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
A = Assembly Location
Y = Year
WW = Work Week
G= PbFree Package
MARKING DIAGRAM
& PIN ASSIGNMENT
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(Note: Microdot may be in either location)
VN2222LLG
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2
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
DrainSource Breakdown Voltage
(VGS = 0, ID = 100 mAdc)
V(BR)DSS 60 Vdc
Zero Gate Voltage Drain Current
(VDS = 48 Vdc, VGS = 0)
(VDS = 48 Vdc, VGS = 0, TJ = 125°C)
IDSS
10
500
mAdc
GateBody Leakage Current, Forward
(VGSF = 30 Vdc, VDS = 0)
IGSSF 100 nAdc
ON CHARACTERISTICS (Note 1)
Gate Threshold Voltage
(VDS = VGS, ID = 1.0 mAdc)
VGS(th) 0.6 2.5 Vdc
Static DrainSource OnResistance
(VGS = 10 Vdc, ID = 0.5 Adc)
(VGS = 10 Vdc, ID = 0.5 Vdc, TC = 125°C)
rDS(on)
7.5
13.5
W
DrainSource OnVoltage
(VGS = 5.0 Vdc, ID = 200 mAdc)
(VGS = 10 Vdc, ID = 500 mAdc)
VDS(on)
1.5
3.75
Vdc
OnState Drain Current
(VGS = 10 Vdc, VDS 2.0 VDS(on))
ID(on) 750 mA
Forward Transconductance
(VDS = 10 Vdc, ID = 500 mAdc)
gfs 100 mmhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 Vdc, VGS = 0,
f = 1.0 MHz)
Ciss 60 pF
Output Capacitance Coss 25
Reverse Transfer Capacitance Crss 5.0
SWITCHING CHARACTERISTICS (Note 1)
TurnOn Delay Time (VDD = 15 Vdc, ID = 600 mA,
Rgen = 25 W, RL = 23 W)
ton 10 ns
TurnOff Delay Time toff 10
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
ORDERING INFORMATION
Device Package Shipping
VN2222LLG TO92
(PbFree)
1000 Unit / Box
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
VN2222LLG
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3
ID, DRAIN CURRENT (AMPS)
ID, DRAIN CURRENT (AMPS)
VDS, DRAIN-SOURCE VOLTAGE (VOLTS)
0.6
0.4
0.2
0.8
1.2
1
012345
1.6
1.4
678910
Figure 1. Ohmic Region
VGS, GATE-SOURCE VOLTAGE (VOLTS)
012345678
910
1.8
2
0.6
0.4
0.2
0.8
1
T, TEMPERATURE (°C) T, TEMPERATURE (°C)
0.4
1
0.8
0.6
1.2
1.6
1.4
, STATIC DRAIN-SOURCE ON-RESISTANCE
DS(on)
r
-60 -20 +20
2
1.8
+60 +100 +140
2.2
2.4
-60 -20 0 +20 +60 +100 +140
0.7
0.85
0.8
0.75
0.9
1
0.95
1.1
1.05
1.15
1.2
(NORMALIZED)
, THRESHOLD VOLTAGE (NORMALIZED)
GS(th)
V
Figure 2. Transfer Characteristics
Figure 3. Temperature versus Static
DrainSource OnResistance
Figure 4. Temperature versus Gate
Threshold Voltage
TA = 25°C
VGS = 10 V
9 V
8 V
7 V
6 V
5 V
4 V
3 V
VDS = 10 V 25°C
125°C
-55°C
VGS = 10 V
ID = 200 mA
VDS = VGS
ID = 1 mA
VN2222LLG
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4
PACKAGE DIMENSIONS
STYLE 22:
PIN 1. SOURCE
2. GATE
3. DRAIN
TO92
CASE 2911
ISSUE AM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
B
K
G
H
SECTION XX
C
V
D
N
N
XX
SEATING
PLANE DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.20
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.021 0.407 0.533
G0.045 0.055 1.15 1.39
H0.095 0.105 2.42 2.66
J0.015 0.020 0.39 0.50
K0.500 --- 12.70 ---
L0.250 --- 6.35 ---
N0.080 0.105 2.04 2.66
P--- 0.100 --- 2.54
R0.115 --- 2.93 ---
V0.135 --- 3.43 ---
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
RA
P
J
B
K
G
SECTION XX
C
V
D
N
XX
SEATING
PLANE DIM MIN MAX
MILLIMETERS
A4.45 5.20
B4.32 5.33
C3.18 4.19
D0.40 0.54
G2.40 2.80
J0.39 0.50
K12.70 ---
N2.04 2.66
P1.50 4.00
R2.93 ---
V3.43 ---
1
T
STRAIGHT LEAD
BULK PACK
BENT LEAD
TAPE & REEL
AMMO PACK
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VN2222LL/D
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